Distributed computing

ABSTRACT

On a typical motherboard the processor and memory are separated by a printed circuit data bus that traverses the motherboard. Throughput, or data transfer rate, on the data bus is much lower than the rate at which a modern processor can operate. The difference between the data bus throughput and the processor speed significantly limits the effective processing speed of the computer when the processor is required to process large amounts of data stored in the memory. The processor is forced to wait for data to be transferred to or from the memory, leaving the processor under-utilized. The delays are compounded in a distributed computing system including a number of computers operating in parallel. The present disclosure describes systems, method and apparatus that tend to alleviate delays so that memory access bottlenecks are not compounded within distributed computing systems.

CLAIM OF PRIORITY UNDER 35 U.S.C. §119

The present Application for Patent claims priority to U.S. ProvisionalPatent Application No. 61/232,353, entitled “SYSTEM AND METHOD FORDISTRIBUTION COMPUTING,” filed Aug. 7, 2009. The above-referencedprovisional patent application is hereby expressly incorporated byreference herein.

BACKGROUND

1. Field

The present application relates to distributed computing, and inparticular, to systems, methods and apparatus configured to enabledistributed computing.

2. Background

The architecture of a typical modern computer is based on the vonNeumann architecture. The von Neumann architecture is a basic design fora stored-program digital computer that includes a processor that isseparated from a memory, which is used to store computer programinstructions and data. Even though typical modern computer architecturesare more complex than the original von Neumann architecture, typicalmodern computers retain the separation between the processor and thebulk memory.

Specifically, along with a number of other components, the processor andmemory are provided on a printed circuit board, referred to as amotherboard (or “main board”, “system board” or “logic board”). On atypical motherboard, the processor and memory communicate via printedcircuit data bus. Throughput, or data transfer rate, on the data bus ismuch lower than the rate at which a modern processor can operate. Thedifference between the data bus throughput and the processor speedsignificantly limits the effective processing speed of the computer whenthe processor is instructed to process large amounts of data stored inthe memory. The processor is forced to wait for data to be transferredto or from the memory, leaving the processor under-utilized.

The performance limitation caused by separating the processor and thememory on a motherboard is referred to as the von Neumann bottleneck.The severity of the bottleneck tends to increase because over timeprocessor speeds and memory sizes tend to increase at a faster rate thanthe improvements in throughput over the data bus connecting newprocessors to bigger memories. Previous attempts to alleviate theproblem have only been partially successful. For example, previoushardware solutions that address the von Neumann bottleneck includeproviding a cache between the processor and the bulk memory, and/orproviding separate caches with separate access paths for data andinstructions; and, previous software solutions include branch predictoralgorithms. However, none of the previous solutions fully address theproblem.

Additionally, the performance degradations caused by the von Neumannbottleneck are exacerbated in a distributed computing environment inwhich computer processing of data is carried out by a number ofprocessors operating simultaneously on smaller portions of a largertask. In a conventional distributed computing environment, such as adata center, multiple computers, each with a respective processor andmemory, are coupled to one another. Typically, in an effort to reduceoverhead, multiple motherboards are connected to one another within onecabinet. Each motherboard is subject to performance degradation causedby the von Neumann bottleneck even if some of the measures discussedabove have been taken to alleviate the full impact of the problem. Assuch, delays in the processing of data caused by the respective databuses on the various motherboards are compounded, as processing servicerequests between processors are subject to delays on each motherboardthat a service request is processed. Accordingly, there lies a challengeto alleviate delays so that memory access bottlenecks are not compoundedwithin distributed computing systems.

SUMMARY

Various embodiments of systems, methods and devices within the scope ofthe appended claims each have several aspects, no single one of which issolely responsible for the desirable attributes described herein.Without limiting the scope of the appended claims, some prominentfeatures are described herein. After considering this discussion, andparticularly after reading the section entitled “Detailed Description”one will understand how the features of various embodiments are used toenable distributed and dynamically reconfigurable computing systems anddevices.

One aspect of the disclosure is an apparatus including a firstintegrated circuit die, the first die having a surface including a firstset of one or more connection pads, wherein each connection pad isconfigured to enable one of communication to and from the first die; asecond integrated circuit die, the second die having a surface includinga second set of one or more connection pads, wherein each connection padis configured to enable one of communication to and from the second die,and wherein the surface of the second die including the second set ofone or more connection pads is arranged to face the surface of thesurface of the first die including the first set of one or moreconnection pads; and a first connector coupling at least one connectionpad of the first set of one or more connection pads to one or morecorresponding connection pads of the second set of one or moreconnection pads.

In one embodiment, the apparatus further includes a third set of one ormore connection pads on the surface of the first die, wherein eachconnection pad is configured to enable one of communication to and fromthe first die; a fourth set of one or more connection pads on thesurface of the second die, wherein each connection pad is configured toenable one of communication to and from the second die; and a secondconnector coupling at least one connection pad of the third set of oneor more connection pads to one or more corresponding connection pads ofthe fourth set of one or more connection pads.

In one embodiment, the apparatus further includes a third integratedcircuit die, the third die having a surface including a third set of oneor more connection pads, wherein each connection pad is configured toenable one of communication to and from the third die, wherein the thirddie is adjacent the first die and disposed facing substantially the samedirection as the first die; a second connector coupling at least oneconnection pad of the third set of one or more connection pads to one ormore corresponding connection pads of the first set of one or moreconnection pads.

In one embodiment, the apparatus further includes a third integratedcircuit die, the third die having a surface including a third set of oneor more connection pads, wherein each connection pad is configured toenable one of communication to and from the third die, wherein the thirddie is adjacent the first die; a fourth integrated circuit die, thefourth die having a surface including a fourth set of one or moreconnection pads, wherein each connection pad is configured to enable oneof communication to and from the fourth die, wherein the fourth die isadjacent the second die and wherein the surface of the fourth dieincluding the fourth set of one or more connection pads is arranged toface the surface of the surface of the third die including the third setof one or more connection pads; and a second connector coupling at leastone connection pad of the third set of one or more connection pads toone or more corresponding connection pads of the fourth set of one ormore connection pads. In one embodiment, the apparatus further includesa fifth set of one or more connection pads on the surface of the firstdie, wherein each connection pad is configured to enable one ofcommunication to and from the first die; a sixth set of one or moreconnection pads on the surface of the third die, wherein each connectionpad is configured to enable one of communication to and from the thirddie; and a third connector coupling at least one connection pad of thefifth set of one or more connection pads to one or more correspondingconnection pads of the sixth set of one or more connection pads. Inanother embodiment, the apparatus further includes a fifth set of one ormore connection pads on the surface of the second die, wherein eachconnection pad is configured to enable one of communication to and fromthe second die; a sixth set of one or more connection pads on thesurface of the fourth die, wherein each connection pad is configured toenable one of communication to and from the fourth die; and a thirdconnector coupling at least one connection pad of the fifth set of oneor more connection pads to one or more corresponding connection pads ofthe sixth set of one or more connection pads. In another embodiment, theapparatus further includes a fifth set of one or more connection pads onthe surface of the first die, wherein each connection pad is configuredto enable one of communication to and from the first die; a sixth set ofone or more connection pads on the surface of the third die, whereineach connection pad is configured to enable one of communication to andfrom the third die; a seventh set of one or more connection pads on thesecond die, wherein each connection pad is configured to enable one ofcommunication to and from the second die; an eighth set of one or moreconnection pads on the surface of the fourth die, wherein eachconnection pad is configured to enable one of communication to and fromthe fourth die; a third connector coupling at least one connection padof the fifth set of one or more connection pads to one or morecorresponding connection pads of the sixth set of one or more connectionpads; and a fourth connector coupling at least one connection pad of theseventh set of one or more connection pads to one or more correspondingconnection pads of the eighth set of one or more connection pads.

One aspect of the disclosure is an apparatus including a first pluralityof integrated circuit chips arranged on a first plane; a secondplurality of integrated circuit chips arranged on a second plane,wherein the chips of the second plurality of chips are disposed facingthe corresponding chips of the first plurality of chips; and wherein atleast some of the first plurality of chips are connectable tocommunicate with at least some of the second plurality of chips, andwherein at least some of the first plurality of chips are connectable tocommunicate with at least one adjacent chip in the first plurality ofchips.

In one embodiment, at least some of the second plurality of chips areconnectable to communicate with at least one adjacent chip in the secondplurality of chips. In one embodiment, at least some of the firstplurality of chips are configured to include processors. In oneembodiment, at least some of the first plurality of chips include astandard external interface and a custom internal interface. In oneembodiment, at least some of the second plurality of chips areconfigured to include memory elements.

In one embodiment at least some of the first plurality of chips areconfigured to be switched between an activated and deactivated state.For example, some of the first plurality of chips are configured tosense a reduction in demand for service and automatically switch to thedeactivated state when the sensed demand for service crosses athreshold. In other example, some of the first plurality of chips areconfigured to sense an increase in demand for service and automaticallyswitch to the activated state when the sensed demand for service crossesa threshold.

One aspect of the disclosure is an integrated circuit package includinga first conductive tray having a planar inner surface and a sidewallextending from the planar inner surface, the planar inner surfaceconfigured to receive and provide an electrical ground connection to afirst integrated circuit die; and a second conductive tray having aplanar inner surface and a sidewall extending from the planar innersurface, the planar inner surface configured to receive and provide anelectrical ground connection to a second integrated circuit die, whereinonce assembled the first die and second die are disposed facing oneanother, and wherein the respective sidewalls of the first a secondconductive trays mate so as to make contact and also provide at leastone gap through which a signal lead can extend; at least one electricalground tab connectable to at least one of the first and secondconductive trays and also connectable to at least one of the first dieand the second die; at least one signal tab extending through arespective gap between the respective sidewalls of the first and secondconductive trays; and at least one power line enveloped by a insulatorabutting the first and second conductive trays, the at least one powerline including at least one contact connectable to at least one of thefirst die and the second die.

One aspect of the disclosure is an apparatus including a first substratefor supporting a plurality of dual-chip carriers, the first substratehaving first and second sides; a plurality of dual-chip carriersdisposed on the first side of the first substrate. In one embodiment,each dual-chip carrier includes a first conductive tray having a planarinner surface and a sidewall extending from the planar inner surface,the planar inner surface configured to receive and provide an electricalground connection to a first integrated circuit die; and a secondconductive tray having a planar inner surface and a sidewall extendingfrom the planar inner surface, the planar inner surface configured toreceive and provide an electrical ground connection to a secondintegrated circuit die, wherein once assembled the first die and seconddie are disposed facing one another, and wherein the respectivesidewalls of the first a second conductive trays mate so as to makecontact and also provide at least one gap through which a signal tab canextend; at least one electrical ground tab connectable to at least oneof the first and second conductive trays and also connectable to atleast one of the first die and the second die; at least one signal tabextending through a respective gap between the respective sidewalls ofthe first and second conductive trays; and at least one power lineenveloped by a insulator abutting the first and second conductive trays,the at least one power line including at least one contact connectableto at least one of the first die and the second die.

One aspect of the disclosure is a method of reconfiguring a systemincluding a plurality of integrated circuit chips, the method includingtransmitting at least one test message to a chip under test from aneighboring chip; waiting for a response from the chip under test;confirming communication in response to receiving a response from thechip under test; deeming the chip under test to be in a failed statewhen a response is not received before the timer crosses a firstthreshold; and one of ceasing to utilize the chip under test andreassigning functions previously assigned to the chip under test to analternate chip in response to deeming the chip under test to be in afailed state.

In one embodiment the method further includes identifying one or moreneighboring chips to the chip under test; and selecting a first neighborchip to transmit the test message. In one embodiment, the method furtherincludes determining whether or not there are any remaining alternateneighboring chips that have yet to attempt communication with the chipunder test in response to a second timer crossing a second threshold;selecting an alternate neighboring chip to transmit a test message inresponse to determining that there are remaining alternate neighboringchips; and deeming the chip under test to be in a failed state inresponse to determining that there are no alternate neighboring chipsthat have yet to attempt communication with the chip under test. In oneembodiment, the method further includes confirming communication accessto the chip under test; and testing the function of the chip under testby providing at least one test vector with a known response.

One aspect of the disclosure is a method of requesting service from aremotely located integrated circuit die, the method includingdetermining a remote service requirement; transmitting a service requestto a neighboring integrated circuit die; waiting to receive a firstacknowledgement message; and waiting to receive a second acknowledgementmessage negating the first acknowledgement message. In one embodiment,the first acknowledgement message indicates a non-acknowledgement of theservice request, and the second acknowledgement indicates anacknowledgement of the service request.

In one embodiment, the method further includes determining when a firsttimer crosses a first threshold, wherein the first threshold provides anindication of the amount of time elapsed since the service request wastransmitted without having received the first acknowledgment;determining whether or not a fault threshold has been breached inresponse to the first timer crossing the first threshold; transmittingthe service request to an alternate neighbor in response to a breach ofthe fault threshold; and re-transmitting the service request in responseto a non-breach of the fault threshold. In one embodiment, the methodfurther includes receiving the first acknowledgement message;determining when the first timer crosses a second threshold, wherein thesecond threshold provides an indication of the amount of time elapsedsince the service request was transmitted without having received thesecond acknowledgment; determining whether or not a fault threshold hasbeen breached in response to the first timer crossing the secondthreshold; and re-transmitting the service request in response to anon-breach of the fault threshold. In one embodiment, the method furtherincludes receiving a first response to the service message; andestablishing a data tunnel to the remotely located integrated circuitdie in response to receiving the first response.

One aspect of the disclosure is a method of processing a service requestfrom a neighbor integrated circuit die, the method including receiving aservice request; transmitting a first acknowledgement message inresponse to receiving the service request; and transmitting a secondacknowledgement message in response to satisfying at least onecondition. In one embodiment, the first acknowledgement messageindicates a non-acknowledgement of the service request, and the secondacknowledgement indicates an acknowledgement of the service request. Inone embodiment, the method includes determining whether or not theservice request satisfies a condition of reception.

In one embodiment, the method further includes: determining whether ornot the service request can be processed locally; processing the servicerequest in response to determining that the service request can beprocessed locally; and transmitting the service request to anotherintegrated circuit die in response to determining that the servicerequest cannot be processed locally. In one embodiment, the methodfurther includes establishing a data tunnel to the requesting integratedcircuit die; and transmitting one or more responses to the requestingintegrated circuit die via the data tunnel.

One aspect of the disclosure is a method of initializing a sleep modefor an integrated circuit chip, the method including: sensing anindicator to enter sleep mode;

evaluating the indicator to determine how many components to deactivate;and selectively deactivating one or more components in response to theresults of the evaluation of the indicator. In one embodiment, sensingthe indicator includes receiving a command to enter sleep mode. In oneembodiment, sensing the indicator comprises sensing the loss of one ormore input signals.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified perspective view of one embodiment of adistributed computing architecture including an arrangement of a numberof integrated circuit dice.

FIG. 2 is a simplified side view of one embodiment of the distributedcomputing architecture shown in FIG. 1.

FIG. 3A is a simplified perspective view of one integrated circuit dieshown in FIG. 1.

FIG. 3B is a simplified perspective view of another integrated circuitdie shown in FIG. 1 which is arranged facing the integrated circuit dieshown in FIG. 3A.

FIG. 4 is a simplified plan view of one embodiment of an arrangement ofchip carriers configured to enable distributed computing systems,methods and apparatus.

FIG. 5 is a block diagram of one embodiment of integrated circuitcomponents arranged to enable distributed computing systems, methods andapparatus.

FIG. 6 is a block diagram of another embodiment of integrated circuitcomponents arranged to enable distributed computing systems, methods andapparatus.

FIG. 7 is a cross sectional view of one embodiment of a chip carrier andtwo integrated circuit dice.

FIG. 8 is a simplified perspective view of one embodiment of a hexagonalchip carrier.

FIG. 9A is a top view of a tape automated bonding sheet.

FIG. 9B is an enlarged plan view of the tape automated bonding sheet ofFIG. 9A.

FIG. 10 is a simplified perspective view of one embodiment of adistributed computing module including a number of hexagonal chipcarriers illustrated in FIG. 8.

FIG. 11 is a cross sectional view of one embodiment of two chipcarriers.

FIG. 12 is another cross sectional view of one embodiment of two chipcarriers.

FIG. 13 is a plan view of one embodiment of a substrate including groundand power connections.

FIG. 14A is a plan view of one embodiment of an arrangement of chipcarriers.

FIG. 14B is a plan view of one embodiment of an arrangement of chipcarriers.

FIG. 15 is a signal flow diagram of one embodiment of a method ofdistributed computing.

FIG. 16 is a flowchart illustrating one embodiment of a method ofdistributed computing.

FIG. 17 is a flowchart illustrating one embodiment of a method ofdistributed computing.

FIG. 18 is a flowchart illustrating one embodiment of a method ofdistributed computing.

FIG. 19 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.

FIG. 20 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.

FIG. 21 is a flowchart illustrating one embodiment of a method ofreactivating an integrated circuit in a sleep mode of operation in adistributing computing system.

FIG. 22 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.

FIG. 23 is a flowchart illustrating one embodiment of a method ofreactivating an integrated circuit in a sleep mode of operation in adistributing computing system.

In accordance with common practice the various features illustrated inthe drawings may not be drawn to scale. Accordingly, the dimensions ofthe various features may be arbitrarily expanded or reduced for clarity.In addition, some of the drawings may not depict all of the componentsof a given system, method or apparatus. Finally, like reference numeralsmay be used to denote like features throughout the specification andfigures.

DETAILED DESCRIPTION

Various aspects of embodiments within the scope of the appended claimsare described below. It should be apparent that the aspects describedherein may be embodied in a wide variety of forms and that any specificstructure and/or function described herein is merely illustrative. Basedon the present disclosure one skilled in the art should appreciate thatan aspect described herein may be implemented independently of any otheraspects and that two or more of these aspects may be combined in variousways. For example, an apparatus may be implemented and/or a method maybe practiced using any number of the aspects set forth herein. Inaddition, such an apparatus may be implemented and/or such a method maybe practiced using other structure and/or functionality in addition toor other than one or more of the aspects set forth herein.

FIG. 1 is a simplified perspective view of one embodiment of anarchitecture for a distributed computing system 100 including anarrangement of a number of integrated circuit dice. For the sake ofclarity, the packaging around individual pairs of dice and connectionsbetween dice are not shown. However, those skilled in the art willappreciate from the present disclosure, and especially with reference toFIGS. 8 and 10, that in one embodiment, individual pairs of dice can bepackaged within a dual-chip carrier also disclosed herein. The system100 includes a first layer of integrated circuit dice arranged over asecond layer of integrated circuit dice. As illustrated in FIG. 1, thefirst layer of integrated circuit dice includes, for example, twelvedice 101 a, 101 b, 101 c, 101 d, 101 e, 101 f, 101 g, 101 h, 101 i, 101j, 101 k, 101 l, arranged in a 3×4 matrix. Similarly, the second layerof integrated circuit dice includes twelve corresponding dice 102 a, 102b, 102 c, 102 d, 102 e, 102 f, 102 g, 102 h, 102 i, 102 j, 102 k, 102 l,arranged in a 3×4 matrix disposed facing the first layer. While FIG. 1shows twenty-four dice arranged in two layers each having three rows andfour columns, those skilled in the art will appreciate from the presentdisclosure that various embodiments of the architecture include anynumber integrated circuit dice arranged in two layers each having anynumber of rows and any number of columns. In particular, in oneembodiment, the first and second layers include a different number ofintegrated circuit dice as compared to one another.

FIG. 2 is a simplified side view of a portion of the system 100illustrated in FIG. 1. Specifically, six of the twenty-four integratedcircuit dice of FIG. 1 are illustrated in FIG. 2, including integratedcircuit dice 101 a, 101 b, 101 c included in the first layer andintegrated circuit dice 102 a, 102 b, 102 c included in the second layerand disposed facing the corresponding dice of the first layer. Theportion of the system 100 illustrated in FIG. 2 also includes exampledata connections between the respective pairs of integrated circuit dicelocated on different layers. For example, die 101 a and die 102 a sharea serial connection 120 a and a parallel connection 130 a. Similarly,die 101 b and die 102 b share a serial connection 120 b and a parallelconnection 130 b. Similarly, die 101 c and die 102 c share a serialconnection 120 c and a parallel connection 130 c. Moreover, while eachpair of dice discussed above share both serial and parallel connections,alternatively, a given pair of dice can be configured to share at leastone of serial connectivity, parallel connectivity or a combination thereof. Moreover, the respective serial and parallel connections discussedabove may be implemented via a number of forms including one or moresolder balls and/or one or more wire leads.

The portion of the system 100 illustrated in FIG. 2 also includesexample data connections between the respective integrated circuit dicelocated on the same layer. For example, die 101 a and die 101 b share aserial connection 110 a. Similarly, die 101 b and die 101 c share aserial connection 110 b. Similarly, die 102 a and die 102 b share aserial connection 112 a. Similarly, die 102 b and die 102 c share aserial connection 112 b. Moreover, while all the data connectionsbetween dice in the same layer are shown to be serial data connections,those skilled in the art will appreciate that each connection may be aserial connection, a parallel connection or a combination operable asserial data connection and a parallel data connection. Moreover, therespective serial connections discussed above may be implemented in anumber of forms including one or more wire leads between chip carrierseach housing two dice arranged facing one another within a particularchip carrier.

FIG. 3A is a simplified perspective view of the integrated circuit die101 f shown in FIG. 1. The integrated circuit die 101 f includes anumber of data connections to surrounding dice. For example, the die 101f shares respective serial data connections 110 e, 111 b, 111 f, 110 fwith the corresponding dice 101 e, 101 b, 101 j, 101 g, which are allincluded in the first layer. Also, for example, the die 101 f shares arespective serial data connection 120 f with the die 102 f. Similar toFIG. 3A, FIG. 3B is a simplified perspective view of the integratedcircuit 102 f die shown in FIG. 1. For example, the die 102 f sharesrespective serial data connections 112 e, 113 b, 113 f, 112 f with thecorresponding dice 102 e, 102 b, 102 j, 102 g, which are all included inthe second layer.

FIG. 4 is a simplified plan view of one embodiment of an arrangement 400of chip carriers configured to permit distributed computing systems,methods and apparatus. Specifically, as an illustrative example only,the arrangement includes seven chip carriers 401, 402, 403, 404, 405,406, 407. Those skilled in the art will appreciate from the presentdisclosure that any number of chip carriers so configured may bearranged together. Each of the seven chip carriers 401, 402, 403, 404,405, 406, 407 is configured to house two dice, one from each of twolayers of dice (e.g. as illustrated in FIG. 1). The chip carrier 401 isplaced at the center of a ring of chip carriers including chip carriers402, 403, 404, 405, 406, 407. Accordingly, each of the chip carriers402, 403, 404, 405, 406, 407 is a neighboring chip carrier to the chipcarrier 401. And as shown in FIG. 4, each chip carrier, other than thechip carrier 401 has three neighboring chip carriers including the chipcarrier 401. For example, the chip carrier 403 has the chip carriers401, 402, 404 as neighbors. In one embodiment, a chip carrier has directcommunication with at least one of the neighboring chip carriers. In oneembodiment, a chip carrier has direction communication with all of theneighboring chip carriers. Furthermore, in one embodiment, a chipcarrier communicates with non-neighboring chip carriers through a datapath that traverses one or more neighboring chip carriers. As describedin further detail below with reference to FIGS. 5 and 6, in variousembodiments, the dice included within each chip carrier include featuresto enable more efficient communication with neighbors and non-neighbors.For example, a data path between the chip carrier 403 and the chipcarrier 406 exists through the chip carrier 401 and at least anotherdata path exists through chip carriers 404 and 405. Either of theaforementioned data paths can be made more efficient by routing dataaway from the primary functional blocks on the dice included in the chipcarriers 401, 404 and 405. In other words, by preventing transient datafrom interfering substantially with the primary function of chipcarriers on the data path, which do not directly contribute to theprocessing of the data at either end of the data path, delays in somecases are reduced.

FIG. 5 is a block diagram of one embodiment of integrated circuitcomponents arranged to enable distributed computing systems, methods andapparatus. Specifically, FIG. 5 illustrates an on-chip system 500 thatincludes features, in addition to the primary function of the chip, toenable more efficient communication with neighbors and non-neighbors. Inparticular, the system 500 includes an internal function module F(X) 501which is the primary functional module of the on-chip system. Forexample, the internal function is a graphics processor, a generalpurpose processor, a data storage element or any other type of devicethat may be embodied as an integrated circuit. That is, the internalfunction module 501 can be any one of several functions, such as aprocessor, a memory, a multi-core processor, intelligent memory, amulti-array memory, a field programmable gate array (FPGA), anapplication specific integrated circuit (ASIC), an array sensor, amotion sensor, or a linear circuit. The internal function of the blockis dependent on the ICs packaged within the chip carrier. Processed datafrom the internal function block is received in a parallel fashion andformatted into serial data which is output from the building block.

The system 500 also includes an external communications interface (ECI)520, a non-blocking cross-point switch 530, a configuration controlprocessor (CCP) 540, a local private memory (LPM) 550, and an internalfunction interface (IFI) 510. The ECI 520 is coupled to the non-blockingcross-point switch (CPS) 530, and the CCP 540. The ECI 520 also includesan external connection 521 that is connectable to external devicesoff-chip either serially or in parallel or a combination of serial andparallel. The non-blocking cross-point switch 530 is also coupled to theCCP 540 and the IFI 510. The LPM 550 is also coupled to the CCP 540 andthe IFI 510. The IFI 510 is coupled to the internal function module 501.In one embodiment, the connection between the IFI 510 and the internalfunction module is a parallel data interface. In one embodiment, theconnection between the IFI 510 and the internal function module is aserial data interface.

The ECI 520 provides direct unshared and shared communication connectionwith neighboring chip carriers. For example, the ECI 520 providescommunication connection with six neighboring devices. Indirectcommunication with remote (non-neighboring) devices is also provideddata paths through neighboring devices. A communication connectionbetween devices provides transfer of information such as instructions,data, commands, and status.

In one embodiment, the ECI 520 contains six output signal lines and sixinput signal lines for communication outside the die. Thus a hexagonalchip carrier can be configured to have six interface sets, one set oneach of the six sides of the chip carrier. In one embodiment, each ofthe six sets is made up of four signal lines, two independentfull-duplex serial communication signal pairs, wherein one pair isconnected to a first IC and the second pair is connected to a second IC.As mentioned above, each interface set can also include two powerconnections and five ground connections.

In one embodiment, static and/or dynamic control of the ECI 520 isperformed by the CCP 540. For example, the CCP 540 provides activationand deactivation of the input signal lines, activation and deactivationof the output signal lines, activation and deactivation of apower-conserving sleep mode, selection of digital or linear transmissionmode, configuration to select an orientation of the installed die to itsdevice package, internal clock signal phase selection, preamble messagedisassembly and dissection, and exception handling.

In one embodiment, the CCP 540 also controls other elements of thedevice. One function of the CCP 540 is to provide assembly informationand static and dynamic control of various elements of the device,including the ECI 520, the CPS 530, the LPM 550, and the IFI 510, towhich the CCP 540 is connected via one or more buses.

Certain configuration information such as a very small iterative routineand history data can be written into a Write Once Read Many (WORM)element of the LPM 550 during manufacture. During various stages ofmanufacturing, assembly, and test operations, other data can be writteninto the LPM WORM by the CCP 540, such as the date of die wafermanufacture; various tests, dates, and results; wafer lot number; andother information.

Static and dynamic configuration and reconfiguration performed by theCCP 540 can be conducted at any time, including during program loadingand execution. Safeguards can be implemented to prevent interference ofexecuting programs or routines, except at prescribed operating points.For example, in one embodiment, the system can change from operatingwith one set of operating rules to operating with another set ofoperating rules. In one embodiment, more than one operating system willreside in a device package to allow the system to quickly changeoperating functions, on demand, to be able to respond to a different setof operational conditions. The system can respond by changing from oneoperating system to another, resulting from an external stimulus, toprovide dynamic reconfiguration. Dynamic reconfiguration has thepotential to expand the capability of a processing system by includingmultiple operating systems that can be selected to handle differentcomputing needs, problems, or assignments. This can expand the range ofwork, processing power, and speed in handling complex tasks. It alsoallows the processing system to address multiple incoming threats,improving overall security. Multiple operating systems can quicklyrespond to a threat and, if the threat increases, while in a threatoperating environment, the operating system can be elevated to a higherthreat level by changing to another operating system. In anotherembodiment, the system, or portions thereof, can load a secondaryoperating system based on the primary threat. As mentioned above, theCCP 540 can control this configuration and reconfiguration of all theelements of a device die.

In one embodiment, the CCP 540 is configured to operate from firmwareand software stored in the LPM 550. The LPM 550 can include, forexample, write once read many (WORM) memory, random access memory (RAM),and electrically erasable and programmable read-only memory (EEPROM),which include flash memory. In another embodiment, the CCP 540 isadditionally or alternatively configured to operate from firmware andsoftware stored in a bulk memory system of the internal function of oneor both of the embedded ICs.

In one embodiment, the CCP 540 of a device can read and write from thememory of the device, including erasing EEPROM of the device. In anotherembodiment, the CCP 540 can directly address the memory of neighboringdevices and indirectly address remote memories, including both bulkmemories of the internal functions and the LPM 550 of remote devices. Inone embodiment, only the local CCP 540 of a device can write informationinto the WORM memory of the device; however, at least a portion of theinformation stored in the WORM memory can be accessible to other deviceson a read only basis. In one embodiment, some of the information in theLPM 550 or bulk memory can only be accessed by the local CCP 540.

In one embodiment, the LPM WORM memory is used to retain informationthat is not intended to change, such as information relative to thehistory of the die, process tracking information that becomes availableduring the manufacture and assembly process, or a start up “boot strap”routine. In one embodiment, the “boot strap” firmware routine is asparingly programmed reiterative loop routing intended to providecommunication in a simple form so as to provide only the ability to loadanother program with a more substantial communication routine. In oneembodiment, the routing includes a method whereby the CCP 540 escapesthe reiterative loop to execute the second more substantial routine thatallows further communication with other memories, registers, and logicof the die.

In one embodiment, the LPM 550 includes random access memory (RAM),accessible by the CCP 540. The RAM can include a volatile RAM scratchpad memory. The RAM can provide, among other things, volatile softwareprogram storage and temporary data storage. Because of the RAM memoryvolatility, any data in RAM memory can be lost in the event of a powerfailure or a complete power shut down. Thus, in one embodiment, aminimal “keep alive” current or voltage is implemented to prevent datafrom being lost when the chip is in a sleep mode of operation.

In one embodiment, the LPM 550 includes EEPROM for storage of data thatis semi-permanent, such as constants, or storage of firmware. The EEPROMis non-volatile but can be electrically erased and re-written.

Write Once Read Many (WORM), Random Access Memory (RAM) and ElectricallyErasable Programmable Read Only Memory (EEPROM) can be addressed as ablock, that is, each has an addressable block of addresses within ablock of addresses.

In one embodiment, the LPM 550 stores permanent data as well asdynamically changing data. Permanent data includes information such asmanufacturing and assembly information and specific bootstrappinginformation. Dynamic data includes Configuration Control Processorprogram code and parameter data for the setup and control of internalportions of the device, including the local internal function module501.

In operation, the CPS 530 generally provides selective connectionbetween lines of the ECI and the IFI. In one embodiment, the CPS is anon-blocking switch which takes as input, signals from the ECI and theIFI and provides, as output, one of those same signals to the inputs ofthe ECI and IFI.

In one embodiment, the CPS 530 receives data from twelve ECI inputs andfour IFI inputs. In one embodiment, the source and destination ofsignals are addressed via address registers which can include: source ofall sixteen input signals as a group, destination of all sixteen outputsignals as group, source of all ECI input signals as a group,destination of all ECI output signals as a group, source of all externalECI input signals as a group, destination of all external ECI outputsignals as a group, source of all internal ECI input signals as a group,destination of all internal ECI input signals as a group, source of allIFI signals as a group, destination of all IFI signals as a group,source and destination of all input and output signals as group, orindividually selected source and destination input and output signals asgroup.

The content of the CPS address registers can be updated by the incomingdata address. The content can also be overwritten on at least atemporary basis by the CCP until control is released by the CCP 540. Inone embodiment, when the CCP 540 takes control, it shuts down or divertsthe effected signals and alerts the effected devises so as to preventloss of data. Also, in one embodiment, the CCP 540 has the ability toredirect the input to output signal switch selection where data isrouted between two devices via this intervening device.

In one embodiment, the CPS 530 is a 16×16×1 switch that steers databetween six external data connections of a die and/or four internal dataconnections of the IFI with the die under direction of the CCP 540. Inone embodiment, the chip carrier die utilizes six of the twelve externalconnections for communication to neighboring chip carrier and theremaining connections to the other die within the chip carrier. Althoughin one embodiment, the steering is performed by the CCP 540, in anotherembodiment, such as can be used during bootstrap/debug operations,firmware can set specific CPS 530 connections to steer data and controlsfrom the ECI 520 to locations within the LPM 550 and to the controls ofthe CCP 540.

The CPS 530 contains connections to the ECI 520 and the IFI 510. The ECI520 is described in detail above, whereas the IFI 510 is describedbelow. The IFI 510 provides connections (buses) to the internal functionmodule 501 which can include any logic function such as memory, dataprocessor, ASIC, FPLA, sensor, etc. For example, depending on theinternal function module 501, the IFI 510 can provide multiple 128-bitbuses for connection to the internal function module 501.

In operation, the IFI 510 controls direct communication access to theinternal function module 501. As such, it receives all or substantiallyall signals originating from the internal function module 501. The ECI520 controls direct communication access with external devices. In oneembodiment, the ECI 520 determines whether or not a received packet canbe and/or is addressed to be processed by the internal function module501. If the packet can be and/or is addressed to be processed by theinternal function module 501, the ECI 520 passes the packet to thenon-blocking CPS 530 and CCP 540. The packet is then passed through theIFI 510 to the internal function module 501 for substantive processing.

On the other hand, if the packet is addressed for another chip and/orcannot be serviced locally, and is thus merely passing through thesystem 500, the ECI 520 retransmits the packet to another chip, therebypreventing the packet from disturbing the primary function of theon-chip system 500.

In one embodiment, the chip carrier operates internally in serialfashion, with the exception of the IFI 510 which can operate in serialor parallel. In one embodiment, the internal function includes aparallel internal function, PF(x). For example, PF(x) can be implementedas a parallel processor or as a parallel memory, sensor, scan array, anyfunction that originates as a parallel device that can be contained inthe allotted area of the chip carrier.

In another embodiment, the internal function includes a serial internalfunction, SF(x). Serial processing arithmetic logic units (ALUs) providecertain advantages over parallel ALUs. One advantage is that serialprocessors are generally implemented with fewer logic elements than aparallel processor of equal capability. In some cases, a serialprocessing unit is much simpler than the parallel equivalent, havingless transistors and/or a simpler design layout.

Further, many peripheral devices such as keyboard, mouse, data storagedisks, monitors, music, USB, internet, etc., use a serial transmissioninterface. Using serial communications uses fewer wires, smaller lessexpensive connectors, and each device does not require aparallel-to-serial data converter to receive data and aserial-to-parallel data converter to send data. Since the above devicesare all naturally serial devices, the logical transmission interface canbe serial transmission of data.

Embodiments illustrating communication with a serial device aredescribed below. In one embodiment, the system uses the clock signalsupplied by the peripheral device to transfer data in both directions.Although the clock signal supplied by the system to the peripheraldevice can be many, many times faster than the peripheral clock rate,reliable transmission can still occur. When the system wishes tocommunicate with the peripheral device, the system places its high speedclock signal on the transmit line to the peripheral device. Whether ornot the peripheral device can follow the clock signal, it will easily beable to discern the presence of signal on the line and send its slowerclock signal back to the system on its transmit line. In response, thesystem can switch from its normal transmitted clock frequency to thespeed of the peripheral clock signal and send the lower speed clocksignal back to the peripheral device. Using this received clock from thesystem, the peripheral device can determine when the two machines are insync and send an End of Transfer (EOT) back to the system. If the systemand the peripheral device are not in sync, the system can adjust thereturn clock phase by relatively small increments until synchronizationis achieved.

In the above embodiment, the system initiated communication with theperipheral device. In another embodiment, communication is initiated bythe peripheral device. In one embodiment, A similar method is used.

Described below are various modes of communication operation and nodalcontrol processing (NCP) enabled by these various modes. Those of skillin the art will appreciate that alternative embodiments can exclude someof the described modes or include other modes not described in detailherein.

Direct addressing of resources of near neighbor devices for passage ofinstructions, data, commands and status can use the (TRA) addresscontained in a standard format and protocol, as in all communicationsbetween devices. If the direct path port is busy or reserved, themessage can be placed in a port queue for later transmission or sent asan indirect message via another intervening device. If the port is notavailable for some other reason, such as failure, the message can alsobe sent indirectly via another intervening device. If the port isreserved it can still be able to transmit messages, stored in queue,during non-busy periods of the reserved transmission port. Reservedports can be configured to operate in one of at least two ways. In oneembodiment, the reserved port is locked to a device other than thereserving device. In another embodiment, the device can share the port,holding priority access to the port for the reserving device.

With indirect addressing, the path to the remote destination terminaldevice can be selected in several ways. In one embodiment, indirectremote addressing takes place via at least one intervening device.

In one embodiment, particularly useful when there is a great amount ofdata to be transmitted or if time sensitivity cannot tolerateinterruptions, there is provided a pre-reserved path from the sendingdevice to the remote receiving terminal device. To reserve paths inintervening devises, an originating device can send a message to aremote receiving terminal device and via this message pre-reserves thepath along the way, even in intervening devices. In one embodiment, thismessage includes an indication to either lock the reserved path or tonot lock the reserved path. In one embodiment, the pre-reserved pathremains in effect until instructed by the originating device to severthe path in a similar manner to that used to initiate the path. Inanother embodiment, the pre-reserved path is severed after apre-determined amount of time if it is not used, thereby freeing systemresources. In one embodiment, if the message indicates that the path isnot to be locked, a higher priority transmission can request temporaryuse of the path on a non-interfering basis.

Reserving a path, in one case, simply means that the reserving devicehas the highest priority and will bypass the transmission queue and goto the first position of the queue. The reserved port can still beavailable to transmit messages from the port queue on a First In FirstOut (FIFO) basis. If the transmission path must always be available tothe reserving device, a second case can provide the ability of the CCP540 to lock out storage of messages to and/or transmissions from thequeue.

Another embodiment of remote transmission is to place data in anavailable port queue for transmission on a first in (come) first out(served) (FIFO) basis when the queue is available.

Yet another embodiment of remote transmission is to pre-assign, bypriority, positions in the port queue for transmission. This embodimentcan advantageously be used for non-interfering transmission to/from thequeue.

Yet another embodiment of remote transmission is a so-called “Hand-Off”of a message destined for a remote terminal device from the originatingdevice to a near neighbor device. The receiving near neighbor device hasthe option to follow the addressing guideline it receives from theoriginating device; however, it also has the option to modify theaddress route because the addressed port has a large built up queue, theport is reserved, there is a better route available, to balance trafficof a transmission port, or for other reasons. The received device willthen hand off the message to the next device over the selected port.

Still another embodiment of remote transmission can advantageously beused when a message is to be sent to all or a prescribed set of devices.Thus, the message is broadcast to the devices by spidering out from theoriginating device to the intended devices. This broadcast will takeplace in one of at least three ways: i) directly and automatically afteran authority device transmits a “Device Reset” to the intended devices;ii) on a demand basis; or iii) on a non-interfering basis. A broadcastcan take place via devices that are not a designated broadcastrecipient. Broadcasting can be used, for example, to distribute softwarecode and/or data to many carriers in a spider-type fashion to ‘bulkload’ groups of carriers.

Connection between the IFI 510 and the CPS 530 provide a pathway forinstructions, addresses, commands, data, status, and other informationbetween the ECI 520 and the internal function module 501. For testpurposes, the CCP 540 can test the internal function or interact withthe signals of the ECI 520 to perform tests of the ECI 520 or theinternal function. The CCP 540 can, for example, cause the diversion ofpre-determined signals to be read from certain locations of LPM 550 andsignals to be stored in certain locations of LPM 550. In this way, theCCP 540 can access both local private memories and the internal functionmemory via the interface registers.

As shown in FIG. 5, the IFI 510 provides connections between the CCP540, LPM 550, CPS 530 and the internal function module 501. In oneembodiment, the internal function includes a processor in the lower dieposition and at least one of a memory, sensor, imager, or secondprocessor in the upper die position. In one embodiment, the internalfunction includes a processor in the lower die position and a bulkmemory in the upper die position. This processor-memory configurationcan directly execute software or firmware applications stored in thememory through the use of parallel signal buses. In another particularembodiment, the internal function includes a processor in the lower dieposition and a sensor or imager in the upper die position, wherein thesensor or imager in the upper die position also includes memory. Thismemory can, for example, store software or firmware to support thesensor or imager functionalities.

A node can be capable of processing that standalone elements areincapable of. In one embodiment, “lock step execution” is controlled,not on a clock basis, but on an execution basis. A provision to preventsystem lockup can also be included.

In one embodiment, NCP provides direct access from the periphery inputsignal of a chip carrier through the ECI 520 and the CPS 530 to the IFI510 parallel register that services the internal function. Likewise, theinternal function data is placed in a parallel output register in theIFI 510, passed directly through the CPS 530 and the ECI 520 to theperiphery signal connection. In one embodiment, NCP can disallow portcommunication access, of unused ports, so as to not allow disruptiverequests from other processes external to a node and not used in thenode.

Each node can be assigned to specific functions or perform as a generalpurpose processor. For example, in various embodiments, a node can beused as a single processor, a pre processor, a data processor, a postprocessor, an input processor, an output processor, an intelligentmemory control, an interface control processor, a memory controlprocessor, an array processor, a wave front processor, or variouspermutations and combinations of the above. It will be appreciated thatother interoperability uses of nodes is also envisioned. Further, eachnode can be dynamically and statically controlled to, e.g., change nodalconnections.

FIG. 6 is a block diagram of another embodiment of integrated circuitcomponents arranged to enable distributed computing systems, methods andapparatus. Specifically, FIG. 6 illustrates an on-chip system 600 thatincludes features, in addition to the primary function of the chip, toenable more efficient communication with neighbors and non-neighbors.The on-chip system 600 is similar to and adapted from the on-chip system500 illustrated in FIG. 5. Accordingly, elements common to both on-chipsystems 500 and 600 share common reference indicia, and only differencesbetween the two are described herein for the sake of brevity. Within thesystem 600, the external communications interface and internalcommunication interface are combined into a dual external-internalcommunications interface 610. The dual external-internal communicationsinterface 610 includes a serial input 601 and a serial output 603 thatare connectable to external devices off-chip. The dual external-internalcommunications interface 610 also includes a parallel output 605 and aparallel input 607 that are connectable to the internal function module501.

Accordingly, in operation, the serial input 601 receives serial datacommunications from off-chip devices. The dual external-internalcommunications interface 610 converts the received serial datacommunications into a parallel stream which is transmitted to theinternal function module 501 via the parallel output 605. In areciprocal manner, the parallel input receives data communications fromthe internal function module 501. The dual external-internalcommunications interface 610 converts the received parallel datacommunications into a serial stream which is transmitted to externaldevices via the serial output 603.

FIG. 7 is a cross sectional view of one embodiment of a chip carrier 700and two integrated circuit dice 701, 702. The chip carrier 700 includesa first conductive tray, serving as a package cap 740, and a secondconductive tray, serving as the package base 750. The first die 701 issubstantially housed by the package cap 740. The first die 701 isoptionally soldered to the package cap 740, as shown in FIG. 7. However,in one embodiment, the first die 701 is not soldered or connected to thepackage cap 740. The second die 702 is substantially housed by thepackage base 750. Connection pads on the two dice are coupled togetherusing solder balls (or the like) 721, 722, 723. The second die 702 isconnectable to another chip carrier or an external device via a signaltab 710 that is coupled to at least one connection tab on the second die702.

FIG. 8 is a simplified perspective view of one embodiment of a hexagonalchip carrier 800. The chip carrier 800 includes sixty connections thatcan be uniformly distributed about the six sides of the hexagon. Theconnections include six power connections, thirty ground connections,and twenty-four signal connections. As mentioned above, in oneembodiment, the power connections and ground connections are attacheddirectly to the substrate, whereas the signal pins are flyingconnections.

Specifically, the chip carrier 800 has a generally hexagonal shape andincludes a first conductive tray 801 and a second conductive tray 802. Agenerally hexagonal or substantially hexagonal shape can very from ahexagon by, for example, having rounded edges, squared edges, bevelededges etc. For the sake of example only, the first conductive tray 801is referred to herein as the package cap 801, and the second conductivetray 802 is referred to herein as the package base 802. In oneembodiment, the cap 801 and the base 802 are approximately 1.25 inchesacross and are made of aluminum nitride, which is an insulator with arelatively high thermal conductivity and a thermal coefficient ofexpansion similar to that of silicon (Si), of which the ICs can be made.

The chip carrier 800 also includes power supply lines 810 a, 810 b, 810c, 810 d, 810 e, 810 f, each of which is located at a respective cornerof the chip carrier 800. The power supply lines 810 a, 810 b, 810 c, 810d, 810 e, 810 f are electrically isolated from the conductive packagebase 802 and cap 801 by corresponding insulating jacket portions 811 a,811 b, 811 c, 811 d, 811 e, 811 f.

Each side of the chip carrier 800 includes five ground pins coupled toboth the package base 802 and the package cap 801. For example, fiveground pins 901, 903, 905, 907, 909 are visible on one side of the chipcarrier 800. Each side of the chip carrier 800 also includes four signalpins that extend into and out of gaps in the sides of the chip carrier800. For example, signal pins 902, 904, 906, 908 are visible on one sideof the chip carrier 800. The signal pins 902, 904, 906, 908 extendthrough corresponding gaps 822, 824, 826, 828, respectively. In oneembodiment, each signal pin is jacketed by a respective electricallyinsulating sleeve at least within the respective gap through which thesignal pin extends. Moreover, while the chip carrier 800 shown has foursignal pins and five ground pins on each side, those skilled in the artwill appreciate that each side of a chip carrier of any shape can beconfigured to include any number of signal pins and any number ofgrounds pins.

Moreover, the chip carrier can be made in a variety of shapes, includingtriangular, square, rectangular, and hexagonal as shown in FIG. 8. Inone embodiment, the chip carrier includes leaded connections, which areelectrical connections having a length of wire or soldering pad thatcomes from the device. Leaded connections can be used for physicalsupport, to transfer power, to probe circuits, and to transmitinformation. Leaded connections from through-hole components are calledpins. These pins can bend under the package body like the letter J,called a J-lead, or come out, down, and form a flat foot for securing tothe board, called an S-lead. In another embodiment, the chip carrierincludes leadless connections. A leadless chip carrier (LCC) is a typeof packaging for integrated circuits that includes leadless connections,which includes rounded pins through the edges of the package.

FIG. 9A is a top view of a tape automated bonding (TAB) sheet 900. TheTAB sheet 900 provides one method of providing signal and ground tabs toone or more integrated circuit dice included in the package 800described above with reference to FIG. 8. Accordingly, as a continuationof the example of FIG. 8, the signal pins 902, 904, 906, 908 and groundpins 901, 903, 905, 907, 909 illustrated in FIG. 8 are also shown inFIG. 9A. FIG. 9B is an enlarged plan view of a portion of the TAB sheet900 of FIG. 9A, which specifically shows enlarged illustrations of theground pins 901, 903, as well as the signal pin 902.

With further reference to FIG. 9A, the signal pins 902, 904, 906, 908are formed when the excess material of the TAB sheet 900 is cut awayalong line 911. Similarly, ground pins 901, 903, 905, 907, 909 areformed when the excess material of the TAB sheet 900 is cut away alongline 913. The signal pins and ground pins for other sides of the chipcarrier 800 are formed in a similar manner using the unmarked pins shownin FIG. 9A. In one embodiment, all of the pins are formed simultaneouslyby shearing away the excess material after the TAB sheet 900 is placedover the combination of the package base 802 and at least one die.

In one embodiment, the TAB sheet 900 is made of relatively thinberyllium copper, on the order of two to three thousandths of an inch.In one embodiment the TAB sheet 900 is made of a thin material so as toprovide flexure of the signal tabs between two adjacent chip carriers(see FIG. 10) to compensate for thermal expansion and contraction. Onemethod of manufacturing the TAB sheet 900 is to etch the center area,leaving a patterned periphery to be sheared to the proper length duringassembly along lines 911 and 913 for example.

FIG. 10 is a simplified perspective view of one embodiment of adistributed computing module, referred to herein as a process moduleelement (PME) 1000, including a number of hexagonal chip carriersillustrated in FIG. 8. A PME as described herein is an assembly ofmultiple substrates with mounted chip carriers and input/outputconnectors, including signal and power connections. In one embodiment,the PME is constructed from approximately sixty piece parts, whereas thetypical motherboard is assembled of upwards of six-hundred piece parts,including an approximately circuit board substrate having between eightand ten layers. As a result, such systems are generallyassembly-intensive products.

FIG. 10 illustrates one embodiment of a PME 1000 including elevenhexagonal chip carriers 800 a, 800 b, 800 c, 800 d, 800 e, 800 f, 800 g,800 h, 800 i, 800 j, 800 k, each having substantially the same design asthe chip carrier 800 shown in FIG. 8. The PME 1000 also includes amounting substrate 1060 which is described in further detail below withreference to FIG. 13. However, briefly, the mounting substrate 1060includes ground vias, such as the first and second vias 1070 a and 1070b, and the power supply vias, such as the first, second and third powersupply vias 1061 a, 1061 b, 1061 c. The hexagonal chip carriers 800 a,800 b, 800 c, 800 d, 800 e, 800 f, 800 g, 800 h, 800 i, 800 j, 800 k aremounted on one side of the substrate 1060. A ribbon shaped heat sink1050 b is located on the opposite surface of the substrate 1060 ascompared to the chip carriers. The ribbon shaped heat sink 1050 bextends across the surface of the substrate 1060 and includes kerfs,such as kerfs 1080, spaced periodically or intermittently across theheat sink 1050 b. The PME 1000 also include a heat transfer blade 1040arranged on the opposite side of the heat sink 1050 b as compared to thesubstrate 1060. The PME 1000 also includes sidewalls 1020 a, 120 b, 1020c that serve the dual function of physically protecting the chipcarriers and providing external connections to the hermaphroditicconnectors 1010.

In the embodiment illustrated in FIG. 10, the hermaphrodite connector isapproximately five inches high and approximately seven eighths of aninch wide. The HCON also has a surround shroud shell including aninterference fit socket one half of the connector with a mating plug onthe other half of the connector. The surround shroud shell can connectthe power return ground. In one embodiment, the surround shroud shell islonger than the power and signal connections, thus being the firstelectrical connection between two devices as they are mated, whereas thepower pins are next in length and next to make power connection. As thepower return ground is the first connected and the power is nextconnected, both prior to signal connection, “hot swapping” of PMEmodules is made possible.

In one embodiment, the surrounding sidewalls provide a receiver for anumber of input/output modules that contain signal drivers andreceivers. The input/output insert modules can be one of a variety ofinsert modules, including a one meter drive fiber optic driver andreceiver pair, a 30-meter drive fiber optic driver/receiver pair, asingle-ended driver/receiver pair, or a double-ended driver/receiverpair. In one embodiment, the connector insert modules include thedriver/receiver electronic circuitry as well as the connector pins andsockets.

The hermaphrodite connector allows a PME to be tested to be insertedinto an operating PME having testing functionality. This PME to betested can be introduced to an operating PME on a “hot swap” basis asdescribed above, wherein plugging one unit into another will not disruptan ongoing process in either module. While the operating PME can bestructurally similar to the unit under test, the operating PME can alsobe a test module built for the test PME devices. In a similar manner, atest PME can be inserted into an operational PME to be tested.

In one embodiment, NCP provides direct access from the periphery inputsignal of a chip carrier through the ECI and the CPS to the IFI parallelregister that services the internal function module. Likewise, theinternal function data is placed in a parallel output register in theIFI, passed directly through the CPS and the ECI to the periphery signalconnection. In one embodiment, NCP can disallow port communicationaccess, of unused ports, so as to not allow disruptive requests fromother processes external to a node and not used in the node.

Each node can be assigned to specific functions or perform as a generalpurpose processor. For example, in various embodiments, a node can beused as a single processor, a pre processor, a data processor, a postprocessor, an input processor, an output processor, an intelligentmemory control, an interface control processor, a memory controlprocessor, an array processor, a wave front processor, or variouspermutations and combinations of the above. It will be appreciated thatother interoperability uses of nodes is also envisioned. Further, eachnode can be dynamically and statically controlled to, e.g., change nodalconnections.

In one embodiment, all chip carriers in a node are similar and/orsubstantially identical. In other embodiments, multiple different kindsof chip carriers are present in a node. While each of the chip carriersin a node may or may not be identical, a few of the chip carriers (byreason of their unique mounted position on the substrate) can be used asinterface controllers. Various interface embodiments are describedabove. Another functionality of a chip carrier is a Nodal ControlProcessor, which provides setup and control of a node or multiple nodes.Multiple nodes can be combined to work as a supernode.

Once a chip carrier, a node, a PME or a combination thereof has beenmanufactured, a programmer can utilize an external host computer to loadand control program code into the device, designated the client device.Various software modules and tools can reside in a host computer such asa laptop, desktop, or a previously configured chip carrier-basedcomputer running an operating system such as Linux. This software can beprogrammed to assist in the development of software modules, routines,nodal control, software tools, and operating systems that will load andcontrol the program code residing in the client device. Such externalsoftware executes in the host computer and not in the client device. Thehost tools and software can include functionality to support the clientdevice during manufacture, initial programming, testing, integration,application development, and debugging.

In one embodiment, the host provides software development tools forportions of a client device. For example, the client device can includea processor (and/or a memory, sensor, etc.) identified as the internalfunction. External tools to support the internal function includeeditors, compilers, linker, and loaders that produce code that can beexecuted on the client device. Other external tools can include toolsand libraries stored on the host device to provide software mechanismsfor communication with and control of the client device.

In one embodiment, the host operating system includes host driversoftware to initiate an interface connection between the host hardwareand the client device hardware. These drivers can be low-level languageroutines called through software tools and the host operating system forcommunication with the client device.

Once the physical communications connections and the software mechanismsare in place, host software tools can use these communicationsmechanisms to setup and control the client device. These tools can beprogrammed to formulate message sequences and control bits to access theclient device. These tools can include an initial bootstrapping sequenceto load more intelligent and complex loaders and routines into theclient device. The host can then treat the client device as a ‘smart’device and communicate with it using high-level messages such that theclient device can remotely perform setup and configuration processes atthe direction of the host.

The host and client device can operate in tandem. The host, for example,can execute a user application partially on the host and partially onthe client. As described above, the client device can be configured asone or more processing nodes having many chip carriers per processingnode. In one embodiment, the host issues processing tasks to the clientdevice and receives the results reported back to the host. In anotherembodiment, the host delegates an entire processing problem to theclient device and then retrieves the solution from the client device.

Various software and firmware modules can also be executed by the clientdevice. The client device can, for example, execute softwareapplications designed specifically for the one or more of the internalfunction processors that resides within the client device. As mentionedabove, at least some portions of the client device are externallycontrollable from the host for initial communication and bootstraploading. In another embodiment, other portions of the client device arecontrollable from within the client device itself. For example, portionsof the setup, controls, and internal logic are accessible from aconfiguration control processor through the use of internal softwareroutines and tools. In one embodiment, internal software performs themain setup and configuration of the client hardware to support a userapplication and to communicate with the host. The user application can,for example, dynamically change hardware settings from within the userapplication by making calls to library routines which reside in anoperating system of the internal function processor.

In one embodiment, operating system library routines executed by theinternal function of the client device support the extensivecapabilities of the client device. The routines can communicate to otherportions of the hardware either through the CCP or directly. Internalsoftware library routines can include routines forconfiguration/reconfiguration and the sending/receiving of messagesacross the communications paths of the client device. In one embodiment,messages pass through the input/output portions of the client devicewithout interfering with the operation of the internal functionprocessing. In another embodiment, messages are received into theinternal function. In yet another embodiment, messages are sent from theinternal function or memory of the client device.

In one embodiment, the internal software contains library routinesavailable to a user application executed on a host device for performingcontrol, setup, and data transfer. At the completion of data transfer, asignal can be returned through the library routine to the userapplication.

In one embodiment, the client device also contains a set of internalstatus and control routines that respond to queries from the host orother client devices. These queries can provide the hooks for debuggingboth the user application and client operating system. A programmer,developer, or application tester can use these status and controlroutines for software debugging. The routine can include routines forcontrolling the internal function, interrogating specific hardware, andviewing and changing memory. In a similar fashion, the host can includecorresponding commands in the host software to status and debug theclient device through a data connection path to these internal softwarestatus and control routines.

The internal software can be configured to support several chip carriersconfigured into a processing node with a group of local communicationspaths. When the processing node is operating, these communicationspaths, data transfers and signaling routines facilitate the userapplication coordination across the multiple chip carriers of theprocessing node.

As mentioned above with respect to the dynamic and staticreconfigurability of such devices, at the completion of the userapplication, internal software can switch to another user applicationthat is to be executed in the client device. In response, the operatingsystem can reconfigure the hardware and the communications paths tosupport the new user application. In another embodiment, the operatingsystem itself can be switched to a one of a different complexity basedon the specific user application and its processing requirements.

In one embodiment, a client device is configured by software executed ona host device to initially define the interconnections between clientdevices. After the interconnections are defined, the operating systemand user application software of the client device is loaded into theassociated hardware by using software tools executed on a host computer.

Additional software executed on a host device can reconfigure theinterconnections and communications paths within the client device whilethe current user application is executing on the client device. Thereconfiguration can also allow the change of the user application and anoperating system defined to support the application requirements. In oneembodiment, when the first user application completes, the second userapplication is ready to reconfigure the hardware architecture andrequired communications paths within a few clock cycles.

Dynamic configuration can be directed from a host computer or it can bedirected from within the client device itself through, e.g., libraryroutine calls. These calls can be based from the currently configuredclient devices or it can be from an additional device directing thereconfiguration, such as with the PME Module Control Processor.

Dynamic configuration can, in one embodiment, support a ‘failedcomponent’ workaround. For example, if the failed component is aninput/output, a different input/output path can be selected to be used.If the failed component is the internal function processor of a firstchip carrier, a second chip carrier can be used, wherein theinput/output connections are reassigned and the program and data in thememory of the first chip carrier are reassigned to the second chipcarrier.

In one embodiment, chip carriers embodied in a client device areuniquely determined by their physical location on the client device, aninternal identifier, and by software which executes within each chipcarrier. In one embodiment, the client device itself has similaridentification information stored within it. This chip carrier softwarecan range from ‘stand alone’ mathematical type routines to operatingsystems. The desired configuration of the client device can be changedat any time to support this range of processing capabilities.

In one embodiment, a user can determine the complexity of supportrequired for the particular application and select the appropriateoperating system. In another embodiment, the appropriate operatingsystem is automatically selected based on the support required. A numberof operating systems of varying complexity are available for selection.The complexity can, for example, be based on the range of operatingsystem calls that the user software uses. For example, a first operatingsystem can support a few tasks which communicate with near neighbor chipcarriers of a processing node and does not support dynamicreconfiguration. A second operating system can support communicationbetween processing nodes either on the same or distant PME and alsosupport dynamic reconfiguration of subordinate processing nodes to addor subtract processing power of the user application software.

During the development of the particular application, software toolsexecuted on a host computer can configure the particular client deviceoperating systems and libraries to form the executable code which willexecute in the client device or the chip carriers thereof. Thisexecutable code, including operating systems and user applications, canbe transferred to the client device hardware to form a configuredsystem. After this configuration is set, the software tools executed onthe host computer can download changes in the background to the initialconfiguration concurrently while the client device is executing othersoftware. In one embodiment, these changes are coordinated with theclient device hardware and software so as to not interfere with thecurrent client device processing.

FIG. 10 above illustrates one embodiment of a PME which can be used as aclient device. From the figure, it is evident that certain of the chipcarriers are proximal to the input/output interfaces. These chipcarriers, or others, can be designated Module Control Processors (MCPs)and loaded with MCP Software to control the interaction of the PME withother devices. The MCP can also be configured to handle theconfiguration/reconfiguration of the other chip carriers on the PME. TheMCP can also be configured to set up the communications paths betweenchip carriers and to initialize the user application software in thechip carriers. While, in one embodiment described above, these tasks arehandled by a host computer, in another embodiment, they are instead‘off-loaded’ to the MCP for additional flexibility. With thisflexibility, the MCP(s) of the client device can direct their ownreconfiguration by calling appropriate software reconfigurationroutines.

Data passed to/from the PME communications paths are routed through theinput/output portion of the MCPs. In one embodiment, the data is passeddirectly to other chip carriers on the PME bypassing the internalfunction and memory of the MCP, whereas in another embodiment, the MCPcaptures the data, interprets the data, and then directs the data to theappropriate processing node or chip carrier. This capture,interpretation, and direction forms an intermediate level of taskcontrol within the client device. In some embodiments, multiple PMEsoperate together as a processing node. The Module Control Processorswithin the multi-PME node can be configured to handle intermediate datatransfer and reconfiguration control for the processing node.

As mentioned above, the messages can be transmitted in a broadcastingfashion. Broadcasting can be used, for example, to distribute softwarecode and/or data to many carriers in a spider-type fashion to ‘bulkload’ groups of carriers. Broadcasting, as described above, can be usedto load software into many client devices without the need for the hostto individually load each client device.

In one embodiment, software for individual client devices is broadcastto all devices and each individual client device discards informationnot intended for the device. The broadcast software can addressindividual client devices using a unique identification number storedwithin each client device (or chip carrier thereof) during manufactureor testing.

In one embodiment, bootstrapping is used to set up the communicationspaths to and through multiple client devices. After this is completed,information is broadcast to a number of devices and the client devicescan begin processing. Broadcasting can be used in the initial setup ofdevices or for upgrading portions of the devices. These broadcasttechniques allow the host to transmit information to specificallyidentified client devices.

As described above, processor nodes support distributed processing withadditional features such as pre-processing, instruction processing, andpost-processing. In one embodiment, a processor node is dynamicallyconfigurable to operate as a distributed processing system, whereas inanother embodiment, a processor node is dynamically configured tooperate in a traditional processing method as utilized by contemporarysystems.

Distributed processing can be used to provide greater processtransaction throughput by using more than one chip carrier of aprocessor node (or more than one processor node) to operate on data in apipeline fashion. For example, using five HLCCs forming a node could atany point in time operate on five or more different instructionssimultaneously. In one embodiment, during a first clock period, aninstruction is fetched by one chip carrier operating as an InstructionFetch Processor (IFP); during a second clock period, the instruction isinterpreted by the IFP and other chip carriers operating as OperandFetch Processors (OFPs) are directed where to fetch operands; during athird clock period, the OFPs fetch various operands; during a fourthclock period, a chip carrier acting as an Instruction Processor (IP)performs the instruction directed by the IFP; and during a fifth clockperiod, a chip carrier acting as an Instruction Result Processor (IRP)stores the data, from the IP, in the location directed by the IFP. FIG.10 illustrates a processor node with components designated as in theabove example. The Instruction Fetch Processor (IFP), in one embodiment,works in a look-ahead program timing mode and thus, out of sequencejumps (branch) to other locations can be anticipated in most cases andtherefore reduce precious processing time.

FIG. 11 is a cross sectional view of one embodiment of two chip carriers1100 mounted on a substrate 1060. The first of the two chip carriers1100 includes a package base 1120 a, a lower die 1102 a, a ground tab1103 a, an upper die 1101 a and a package cap 1110 a. The package base1120 a is fused to the substrate 1060 with solder 1105 a. The lower die1102 a is fused to the package base 1120 a with solder 1106 a. Theground tab 1103 a is electrically coupled both the package base 1120 aand the package cap 1110 a to receive ground potential. The ground tab1103 a is also coupled to both the upper die 1101 a and the lower die1102 a using solder balls (or the like). Similarly, the second of thetwo chip carriers 1100 includes a package base 1120 b, a lower die 1102b, a ground tab 1103 b, an upper die 1101 b and a package cap 1110 b.The package base 1120 b is fused to the substrate 1060 with solder 1105b. The lower die 1102 b is fused to the package base 1120 b with solder1106 b. The ground tab 1103 b is electrically coupled both the packagebase 1120 b and the package cap 1110 b to receive ground potential. Theground tab 1103 b is also coupled to both the upper die 1101 b and thelower die 1102 b using solder balls (or the like).

With further reference to FIG. 11, one method of manufacturing such achip carrier is as follows. First, align and reflow solder the lower die1102 to the cavity of the carrier package base 1120 a. Second, positiona TAB sheet over the package base 1120 a housing the lower die 1102 a.Third, position the upper die 1101 a over the TAB sheet and lower dieassembly. Fourth, reflow solder the upper die 1101 a to the TAB sheet,the lower die 1102 a and the package cap 1110 a. In one embodiment, theupper die 1101 a is not soldered to the package cap 1110 a. Fifth,reform the signal leads of the TAB sheet for connection to neighboringdevices so as to provide compensation of expansion and contraction dueto temperature variations. Sixth, place and cement the package cap 111aa to the assembly providing a micro strip coaxial transmission pathembedded in a dielectric insulator for each signal line. Finally, solderthe power and ground to the package cap 1110 a, package base 1120 a andTAB sheet. Those skilled in the art will appreciate that the abovedescribes but one embodiment of manufacturing a stack and that othermethods formed by removing, adding, or altering the above steps can beused. Moreover, those skilled in the art will appreciate that specificconnections to particular signal pins and connection pads have not beenexhaustively described for the sake of brevity.

FIG. 12 is another cross sectional view of one embodiment of two chipcarriers 1200. The two chip carries 1200 are similar to and adapted fromthe two chip carriers 1100 illustrated in FIG. 11. Accordingly, elementscommon to both chip carriers 1100 and 1200 share common referenceindicia, and only differences between the two are described herein forthe sake of brevity. Specifically, the two chip carriers 1200 includefirst and second signal tabs 1115 a and 1115 b in place of the first andsecond ground tabs 1103 a and 1103 b illustrated in FIG. 11. The firstsignal tab 1115 a is coupled to a connection pad on the lower die 1102 aand is electrically shielded from the package base 1120 a and packagecap 1110 a. Similarly, the second signal tab 1115 b is coupled to aconnection pad on the upper die 1101 b and is electrically shielded fromthe package base 1120 b and package cap 1110 b. The first and secondsignal tabs 1115 a and 1115 b are electrically connected with solderball 1117, which thereby creates a data path from the lower die 1102 ato the upper die 1101 b. Moreover, those skilled in the art willappreciate that from the present disclosure that any combination ofconnections can be made between the dice 1101 a, 1102 a, 1101 b, 1102 busing signal tabs, and the scope of the claims is in no way limited bythe example illustrated in FIG. 12.

FIG. 13 is a plan view of one embodiment of the substrate 1060 includedin the PME illustrated in FIG. 10. In one embodiment, the substrate 1060is conductive and includes a number of voltage connections arranged soas to provide at least one of power and ground levels to one or morechip carriers. For example, in one embodiment, in operation thesubstrate 1060 is at the same potential as electrical ground. The groundpotential is established and maintained by ground vias, such as thefirst and second vias 1070 a and 1070 b. The first and second vias 1070a and 1070 b, for example, are electrically coupled to the substrate1060. In the example illustrated in FIG. 13, the ground vias areinterspersed between the power supply vias, such as the first, secondand third power supply vias 1061 a, 1061 b, 1061 c. The power supplyvias are electrically insulated from the substrate and are arranged soas to connect to insulated power lines located at the corners of thehexagonal chip carriers. Moreover, while the substrate 1060 isspecifically arranged for receiving and supporting hexagonally-shapedchip carriers, those skilled in the art will appreciate that in anotherembodiment, the ground and power vias can be arranged to accommodateother shapes of chip carriers, such as rectangular and square chipcarriers.

FIG. 14A is a plan view of one embodiment of an arrangement 1400 a ofrectangular chip carriers arranged in a row-by-column manner, such thateach chip carrier has four neighbors with which communication ispotentially available. Specifically, the arrangement 1400 a includesnine chip carriers 1401 a, 1401 b, 1401 c, 1401 d, 1401 e, 1401 f, 1401g, 1401 h, 1401 i. The chip carrier 1401 e is in the center of a ringformed by the chip carriers 1401 a, 1401 b, 1401 c, 1401 d, 1401 f, 1401g, 1401 h, 1401 i. However, since the chip carriers 1401 a, 1401 c, 1401g, 1401 i are located diagonally away from the corners of chip carrier1401 e, it is difficult for chip carrier 1401 e to establish directcommunication with the chip carriers 1401 a, 1401 c, 1401 g, 1401 i. Onthe other hand, the chip carriers 1401 b, 1401 d, 1401 f, 1401 h arebeside broad sides of the chip carrier 1401 e, and as such, it isrelatively more convenient for the chip carrier 1401 e to establishdirect communication with these neighboring chip carriers.

FIG. 14B is a plan view of one embodiment of another arrangement 1400 bof rectangular chip carriers arranged in a brick pattern, such that eachchip carrier has six neighbors with which communication is potentiallyavailable. Specifically, the arrangement 1400 b includes nine chipcarriers 1402 a, 1402 b, 1402 c, 1402 d, 1402 e, 1402 f, 1402 g, 1402 h,1402 i. The chip carrier 1402 e is in the center of a ring formed by thechip carriers 1401 b, 1401 c, 1401 d, 1401 f, 1401 h, 1401 i. Moreover,as result of the brick pattern arrangement, each of the chip carriers1401 b, 1401 c, 1401 d, 1401 f, 1401 h, 1401 i is considered a neighborto the chip carrier 1402 e. Accordingly, in one embodiment the chipcarrier 1402 e is able to establish direct communication with each ofthe chip carriers 1401 b, 1401 c, 1401 d, 1401 f, 1401 h, 1401 i withoutsending signals through other chip carriers or over a printed circuitboard.

FIG. 15 is a signal flow diagram 1500 of one embodiment of a method ofdistributed computing. As described above, in one embodiment a chipcarrier includes two integrated circuit dice, the two integrated circuitdice are arranged so that they face one another and are in communicationwith one another. As such, as described herein communication with a dualchip carrier includes communication with one or both of the integratedcircuit dice included therein.

Specifically, FIG. 15 depicts signaling to facilitate the establishmentof a data tunnel between two chip carriers that each includes one ormore integrated circuit dice. A resulting data tunnel may exist betweentwo adjacent chip carriers or between two chip carriers that areseparated by one or more other chip carriers. While the signal flowdiagram 1500 of FIG. 15 includes only three chip carriers 1501, 1502,1503, those skilled in the art will appreciate that FIG. 15 is merely anillustrative example. Those skilled in the art will also understand fromthe present disclosure that any number of chip carriers may be involvedwith transmitting, processing and responding to a service request and/ortransmitting and/or processing data associated with a service request.

Turning to the example illustrated in FIG. 15, as indicated by block1510, the method includes the first chip carrier 1501 determining and/orgenerating a service request for the third chip carrier 1503. Given thatthe third chip carrier 1503 is not an immediate neighbor of the firstchip carrier 1501, the service request traverses the communicationinterface of the second chip carrier 1502. To that end, as indicatedsignal 1511, the method includes the first chip carrier transmitting alocal packet including the service request to the second chip carrier1502. As indicated by signal 1512, the method includes the second chipcarrier 1502 responding to the first chip carrier 1501 by transmitting a“transmission not-acknowledged” (TNACK) message which indicates that thelocal packet may not have been successfully received. As indicated bysignal 1513, if the local packet was successfully received, the methodincludes the second chip carrier 1502 transmitting a “transmissionacknowledged” (TACK) message to the first chip carrier 1501, whichnegates the automatically transmitted TNACK message. In one embodiment,the first chip carrier 1501 is configured wait for a TACK message afterfirst receiving a TNACK message for a period of time before relying onthe TNACK message. In one embodiment, the chip carrier receiving a localpacket transmits the TNACK and TACK messages back over the same physicalconnection that the local packet is received on, thereby freeing othersignal pins on both chip carriers to communicate in parallel with theTNACK and TACK messages. In other words, the TNACK and TACK messages arereceived by the chip carrier that originally transmitted the localpacket on a signal pin normally used for transmission. As such, signalpins on that chip carrier that are normally used for receiving signalsare free for other communication.

As indicated by signal 1514, the method includes the second chip carrier1502 transmitting the local packet to the third chip carrier 1503. Thesecond chip carrier 1502 may transmit the local packet before, during orafter the second chip carrier transmits the TNACK message and/or theTACK message. Additionally and/or alternatively, the second chip carrier1502 retransmits portions of the local packet as they are received fromthe first chip carrier 1501.

As indicated by signal 1515, the method includes the third chip carrier1503 responding to the second chip carrier 1502 by transmitting a TNACKmessage which indicates that the local packet may not have beensuccessfully received. As indicated by signal 1516, if the local packetwas successfully received, the method includes the third chip carrier1503 transmitting a “transmission acknowledged” TACK message to thesecond chip carrier 1502, which negates the automatically transmittedTNACK message. In one embodiment, the second chip carrier 1502 isconfigured wait for a TACK message after first receiving a TNACK messagefor a period of time before relying on the TNACK message.

As indicated by block 1517, the method includes the third chip carrier1503 processing the service request originally sent by the first chipcarrier 1501. As indicated by block 1518, the method includes the firstand third chip carriers establishing a data tunnel through the secondchip carrier 1502. In one embodiment, in instances where the resultingdata tunnel includes a path including one or more chip carriers (e.g.the second chip carrier 1502) between the two chip carriers where thedata tunnel terminates (e.g. the first and third chip carriers 1501,1503), the data tunnel is established using the respective communicationinterfaces of the middle chip carriers without interfering with theprimary function of the integrated circuits included on those middlechip carriers. In other words, each respective communication interfacesubstantially routes data away from the primary functional units on therespective integrated dice that do not originate a service requestand/or process the service request. As such, only the chip carrier atwhich a service request originates and the chip carrier in which theservice request is processed substantially request, process, access,create and/or consider data traversing the data tunnel. In the exampleillustrated in FIG. 15, the communication interface of one or more ofthe dice included in the second chip carrier 1502 routes data away fromthe primary functional units included in the one or more of the dice, sothat the computing operations of those functional units is substantiallyunaffected.

FIG. 16 is a flowchart illustrating one embodiment of a method ofdistributed computing. The illustrated method can be modified in avariety of ways. For example, in another embodiment, various portions ofthe illustrated method can be combined, can be rearranged in analternate sequence, removed, or the like. Specifically, FIG. 16illustrates a method of requesting remote processing of a servicerequest. For example, with further reference to the signal flow diagram1500 of FIG. 15, the flowchart of FIG. 16 illustrates one method thefirst chip carrier 1501 may follow to establish a data tunnel with thethird chip carrier 1503. To that end, as represented by block 16-1, themethod includes determining a remote service requirement. In otherwords, an integrated circuit within one chip carrier determines throughoperation of software and/or firmware that data or service is requiredfrom another integrated circuit not located within the same chipcarrier. As represented by block 16-2, the method includes preparing aservice request. As represented by block 16-3, the method includestransmitting the service request to neighboring chip carrier. Asrepresented by block 16-4, the method includes waiting for anacknowledgement for a first period of time. If an acknowledgementmessage is not received during the first period (TO path from 16-4), asrepresented by block 16-5, the method includes determining whether ornot a fault threshold has been breached. In one embodiment, a faultthreshold is a predetermined number. The predetermined number isrepresentative of times that a service request can be sent to the sameneighboring chip carrier without receiving an acknowledgement regardingthe reception before the sending chip carrier ceases to transmit servicerequests to that particular neighboring chip carrier. If the faultthreshold has not been breached (No path from 16-5), the method includeslooping back to repeat the transmission of the service request asrepresented by block 16-3. On the other hand, if the fault threshold hasbeen breached (Yes path from 16-5), as represented by block 16-6, themethod includes transmitting the service request to an alternateneighboring chip carrier.

Referring again to block 16-4, if a TNACK message is received within thefirst period of time (TNACK path from 16-4), as represented by block16-7, the method includes waiting for an acknowledgement for a secondperiod of time. The second period of time can be the same or differentthan the first period of time discussed above. If an acknowledgementmessage is not received during the second period (TO path from 16-7), asagain represented by block 16-5, the method includes determining whetheror not a fault threshold has been breached as discussed above. On theother hand, if a TACK message is received within the second period oftime (TACK path from 16-7), as represented by block 16-8, the methodincludes waiting for a response to the service request for a thirdperiod of time. The third period of time may be dynamically set based onthe estimated transmission delays and processing time for a particularservice request. Additionally and/or alternatively, the third period oftime may be a random number or a predetermined fixed number or any othervalue useful for a particular arrangement of chip carriers.

If a response message is not received during the third period (TO pathfrom 16-8), as again represented by block 16-5, the method includesdetermining whether or not a fault threshold has been breached asdiscussed above. On the other hand, if a response message is receivedwithin the third period of time (TR path from 16-8), as represented byblock 16-9, the method includes receiving a response to the servicerequest through a data tunnel. As represented by block 16-10, the methodincludes providing confirmation of reception message and/or furtherservice requests over the data tunnel to the servicing chip carrier.

FIG. 17 is a flowchart illustrating one embodiment of a method ofdistributed computing. The illustrated method can be modified in avariety of ways. For example, in another embodiment, various portions ofthe illustrated method can be combined, can be rearranged in analternate sequence, removed, or the like. Specifically, FIG. 17illustrates a method of receiving and processing a service request. Forexample, with further reference to the signal flow diagram 1500 of FIG.15, the flowchart of FIG. 17 illustrates one method the second and thirdchip carriers 1502, 1503 may follow to establish a data tunnel back tothe first chip carrier 1501. To that end, as represented by block 17-1,the method includes receiving a service request within a local packet.As represented by block 17-2, the method includes transmitting a TNACKmessage in response to receiving the local packet. If the packet wasvalidly received, as represented by block 17-3, the method includestransmitting a TACK message to the chip carrier from which the localpacket was received. As represented by block 17-4, the method includesdetermining whether or not the service request is a request for localservice. If it is determined that the service request is a request forlocal service (Yes path from 17-4), as represented by block 17-5, themethod includes processing the service request locally in order togenerate a response to the service request. As represented by block17-6, the method includes establishing a data tunnel back to therequesting chip carrier. In one embodiment, the data tunnel traversesthe same path that the service request traversed to the servicing chipcarrier. In one embodiment, the data tunnel traverses a shorter and/ormore efficient path. As represented by block 17-7, the method includestransmitting a first response over the data tunnel to the requestingchip carrier. In another embodiment, the data tunnel is establishedbefore or while the service request is processed locally.

Referring again to block 17-4, on the other hand, if it is determinedthat the service request is not a request for local service (No pathfrom 17-4), as represented by block 17-8, the method includestransmitting the service request within a local packet to the next chipcarrier in the path to the servicing chip carrier. As represented byblock 17-9, the method includes determining whether or not atransmission acknowledgement has been received. If a transmissionacknowledgement has been received (Yes path from 17-9), as representedby block 17-10 the method concludes. On the other hand, if atransmission acknowledgment has not been received (No path from 17-9),as represented by block 17-11, the method includes determining whetheror not a fault threshold has been breached. If the fault threshold hasbeen breached (Yes path from 17-11), as represented by block 17-12 themethod includes transmitting the local packet to an alternate neighbor.If the fault threshold has not been breached (No path from 17-11), asrepresented by block 17-8, the method includes retransmitting the localpacket to the same chip carrier.

FIG. 18 is a flowchart illustrating one embodiment of a method ofdistributed computing. The illustrated method can be modified in avariety of ways. For example, in another embodiment, various portions ofthe illustrated method can be combined, can be rearranged in analternate sequence, removed, or the like. Specifically, FIG. 18illustrates a method of testing and dynamically reconfiguring adistributed computing system, such as the system 100 described abovewith reference to FIGS. 1 and 2. As represented by block 18-1, themethod includes selecting a chip carrier for testing. As noted above, achip carrier as described herein can be configured to house one or twointegrated circuit dice. As such, by selecting a chip carrier, one ortwo separate integrated circuit dice are selected for simultaneous orindividual testing depending on the particular configuration of the chipcarrier selected. As represented by block 18-2, the method includesindentifying neighboring chip carriers of the chip carrier selected fortesting. In one embodiment, a subset of the neighboring chip carriers isidentified. In one embodiment, all of the neighboring chip carriers areidentified. As represented by block 18-3, the method includes selectinga first neighboring chip carrier from which to transmit a test packet.

As represented by block 18-4, the method includes transmitting a testpacket (or test vector or the like) from the selected neighbor to thechip carrier under test. As represented by block 18-5, the methodincludes waiting to receive an acknowledgement for a first duration oftime. In one embodiment, for example, the first duration is one of apredetermined duration, a duration randomly determined during operation,a duration determined based on expected processing time of the testpacket. Nevertheless, those skilled in the art will appreciate that thefirst duration can be set in any number of ways and the example providedherein merely illustrate particular possibilities for setting the firstduration.

If an acknowledgement is received during the first duration (ACK pathfrom 18-5), as represented by block 18-6, the method includes confirmingcommunication access to the chip carrier under test. Further, in oneembodiment, the method further including testing the functionality ofthe one or two integrated circuit dice included in the chip carrierunder test once communication access to the chip carrier has beenconfirmed. Testing the functionality of a particular internal functionmodule is dependent on the actual functionality of that particularinternal function module. Those skilled in the art will appreciate howto conduct such testing for a particular chip once communication accessto the chip has been confirmed.

If an acknowledgement is not received during the first duration (TO pathfrom 18-5), as represented by block 18-7, the method includesdetermining whether or not there are identified neighboring chipcarriers that have not yet attempted to transmit a test packet to thechip under test. If there are one or more such neighboring chip carriers(Yes path from 18-7), as represented by block 18-8, the method includesselecting an alternative neighboring chip carrier from the subset of oneor more chip carriers that have not yet transmitted a test packet to thechip carrier under test. Further, the method includes looping back tothe portion of the method represented by block 18-4 so as to repeat thetransmission of the test packet from the newly selected neighboring chipcarrier.

Referring again to block 18-7, if there are no more neighboring chipcarriers that have yet to transmit a test packet (No path from 18-7), asrepresented by block 18-9, the method includes deeming the chip carrierunder test to be in a failed state because none of the neighborsinvolved in the testing were able to confirm communication access withthe chip carrier under test. As represented by block 18-10, the methodincludes rerouting service requests and/or functions previouslydelegated to the chip carrier under test to alternate chip carrierswhere possible. In one embodiment, rerouting service requests and/orfunctions includes computer software that distributes service requestsand/or delegates functions to operable chip carriers, taking intoaccount the loss of capacity of chip carriers that are currently deemedto be in a failed state.

FIG. 19 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.The illustrated method can be modified in a variety of ways. Forexample, in another embodiment, various portions of the illustratedmethod can be combined, can be rearranged in an alternate sequence,removed, or the like. Specifically, FIG. 19 illustrates a method ofinitializing a sleep mode operation. As represented by block 19-1, themethod includes at least one of powering up an internal function module(referenced as F(X) in FIGS. 19-23) and resetting a sleep command flaginternal to the internal function module. As represented by block 19-2,the method includes enabling external communications interface (ECI)receivers. In one embodiment, ECI receivers are assumed to be in activestate so long as the chip receives power. As represented by block 19-3,the method includes a configuration control process (CCP) configuring aninternal function module, an associated cross-point switch (CPS), anassociated local private memory (LPM), and an associated internalfunction interface (IFI). As represented by block 19-4, the methodincludes configuring automatic sleep mode timeout periods. Examples ofsleep mode timeout periods are discussed in further detail below withreference to FIG. 22.

FIG. 20 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.The illustrated method can be modified in a variety of ways. Forexample, in another embodiment, various portions of the illustratedmethod can be combined, can be rearranged in an alternate sequence,removed, or the like. In one embodiment, the method responds to aninstruction that signals an orderly completion of some or alltransactions of modules included on a chip so that one or more of themodules can safely enter an idle state. Specifically, FIG. 20illustrates a method of directing an internal function module into asleep mode of operation. As represented by block 20-1, the methodincludes providing an internal function module with a command to enter asleep mode of operation. As represented by block 20-2, the methodincludes an ECI decoding the sleep mode command. As represented by block20-3, the method includes sending the decoded command to a CCP. Asrepresented by block 20-4, the method includes the CCP decoding thesleep mode command destination. As represented by block 20-5, the methodincludes determining whether or not the sleep mode command is applicableto the entire chip or merely a subset of particular modules included onthe chip.

If the sleep mode command is applicable to the entire chip (Yes pathfrom 20-5), as represented by block 20-15, the method includescompleting the ECI transaction. That is, each ECI port is directed toenter sleep mode by the CCP. In one embodiment, the command originatesfrom a different ECI port than the particular ECI port directed into thesleep mode. In another embodiment, the command originates from the sameECI port directed to enter sleep mode or even the CCP itself. Bycompleting the transaction on a particular ECI port directed to entersleep mode both ends of the transaction complete in a normal manner. Onthe other hand, if a ECI port immediately entered the sleep mode thetransaction would have been truncated and an error would be indicatedand/or induced on the communicating partner of the ECI port.

As represented by block 20-16, the method includes turning off the ECIoutput clock. As represented by block 20-17, the method includes placingthe internal function module F(X) into sleep mode. As represented byblock 20-18, the method includes deactivating the internal functionmodule clocks. As represented by block 20-19, the method includesshutting down the IFI. As represented by block 20-20, the methodincludes shutting down the CCP. In one embodiment, the variouscomponents discussed above are shutdown in the order presented herein.However, those skilled in the art will appreciate that the orderpresented is merely one example of the order in which various componentson a chip can be placed into sleep mode.

Referring again to block 20-5, if the sleep mode command is notapplicable to the entire chip (No path from 20-5), as represented byblocks 20-6 through 20-14, the method includes determining which modulesthe sleep command is applicable to and shutting down those modules. Forexample, as represented by block 20-6, the method includes determiningwhether or not the sleep command is applicable to the internal functionmodule F(X). If the sleep command is applicable to the internal functionmodule (Yes path from 20-6), as represented by block 20-7, the methodincludes placing the internal function module into sleep mode andturning off the internal function module clocks. As represented by block20-8, the method includes determining whether or not the sleep commandis applicable to the ECI port. If the sleep command is applicable to theECI port (Yes path from 20-8), as represented by blocks 20-9 and 20-10,the method includes completing the ECI transaction and turning off theECI output clock. As represented by block 20-11, the method includesdetermining whether or not the sleep command is applicable to the IFI.If the sleep command is applicable to the IFI (Yes path from 20-11), asrepresented by block 20-12, the method includes shutting down the IFI.As represented by block 20-13, the method includes determining whetheror not the sleep command is applicable to the CCP. If the sleep commandis applicable to the CCP (Yes path from 20-13), as represented by block20-14, the method includes shutting down the CCP. As represented byblock 20-21, after processing the portions of the method discussedabove, the method includes providing an indication that the sleep modeof operation has been entered as directed.

FIG. 21 is a flowchart illustrating one embodiment of a method ofreactivating an integrated circuit in a sleep mode of operation in adistributing computing system. The illustrated method can be modified ina variety of ways. For example, in another embodiment, various portionsof the illustrated method can be combined, can be rearranged in analternate sequence, removed, or the like. Specifically, FIG. 21illustrates a method of directing a chip die into an active mode ofoperation that is wholly or partially in a sleep mode of operation. Asrepresented by block 21-1, the method includes providing a chip with acommand to exit the sleep mode of operation. As represented by block21-2, the method includes an ECI decoding the command. As represented byblock 21-3, the method includes determining whether the CCP is in asleep mode of operation. If the CCP is currently in a sleep mode (Yespath from 21-3), as represented by block 21-4, the method includesreactivating the CCP. On the other hand, if the CCP is already active(No path from 21-3), as represented by block 21-5, the method includessending the decoded command to a CCP. As represented by block 21-6, themethod includes the CCP decoding the command destination(s). Asrepresented by block 21-7, the method includes determining whether ornot the command is applicable to the entire chip or merely a subset ofparticular modules included on the chip.

If the command is applicable to the entire chip (Yes path from 21-7), asrepresented by block 21-15, the method includes activating the IFI. Asrepresented by block 21-16, the method includes activating the internalfunction module clock. As represented by block 21-17, the methodincludes activating the internal function module. As represented byblock 21-18, the method includes activating the ECI output clock. In oneembodiment, the various components discussed above are activated in theorder presented herein. However, those skilled in the art willappreciate that the order presented is merely one example of the orderin which various components on a chip can be reactivated from a sleepmode of operation.

Referring again to block 21-7, if the command is not applicable to theentire chip (No path from 21-7), as represented by blocks 21-8 through21-14, the method includes determining which modules the command isapplicable to and activating those modules. For example, as representedby block 21-8, the method includes determining whether or not thecommand is applicable to the internal function module. If the command isapplicable to the internal function module (Yes path from 21-8), asrepresented by blocks 21-9 and 21-10, the method includes reactivatingthe internal function module clocks and the internal function module. Asrepresented by block 21-11, the method includes determining whether ornot the command is applicable to the ECI port. If the command isapplicable to the ECI port (Yes path from 21-11), as represented byblocks 21-12, the method includes activating the ECI output clock. Asrepresented by block 21-13, the method includes determining whether ornot the command is applicable to the IFI. If the command is applicableto the IFI (Yes path from 21-13), as represented by block 21-14, themethod includes activating the IFI. As represented by block 21-19 afterprocessing the portions of the method discussed above, the methodincludes providing an indication that the sleep mode of operation hasbeen exited as directed.

FIG. 22 is a flowchart illustrating one embodiment of a method ofshifting to a sleep mode of operation in a distributed computing system.The illustrated method can be modified in a variety of ways. Forexample, in another embodiment, various portions of the illustratedmethod can be combined, can be rearranged in an alternate sequence,removed, or the like. Specifically, FIG. 22 illustrates a methodenabling a chip to sense conditions indicative of lower activity andautomatically and autonomously enter a sleep mode of operation. In oneembodiment, when one or more clock signals provided to a chip becomeunavailable the chip responds by transitioning into a reset state andpowers down one or more functional blocks with the possible exception ofthe ECI receivers. In one embodiment, even in a sleep mode of operation,the LPM and internal function module are provided with a keep-alivepower supply in order to retain information stored in volatile memory.As represented by block 22-1, the method includes configuring anautomatic sleep mode sensing scheme. As represented by block 22-2, themethod includes determining whether externally provided clocks are nolonger available. If it is determined that the external clocks are nolonger available (Yes path from 22-2), as represented by block 22-12,the method includes automatically deactivating a number of modulesincluded on a chip, but maintaining active operation of the ECIreceivers.

On the other hand, if the external clocks are available (No path from22-2), as represented by block 22-3 through 22-11, the method includesdetermining which modules have a sufficiently low level of activity fora sufficiently long enough period of time to justify placing the modulesindividually into a sleep mode of operation. For example, as representedby block 22-3, the method includes determining whether or not theinternal function module is idle. If the internal function module is notidle (No path from 22-3), in one embodiment it is assumed that enteringa sleep mode of operation would be disruptive to ongoing computing bythe chip. As such, as indicated by block 22-13, the method terminates.On the other hand, if the internal function module is idle (Yes pathfrom 22-3), as represented by block 22-4, the method includesdetermining if a internal function module sleep timer has expired,indicating that the internal function module has been idle for at leastas long as the initial value of the timer. If the timer has not expired(No path from 22-4), as represented by block 22-13, the methodterminates. If the timer has expired (Yes path from 22-4), asrepresented by block 22-5, the method includes deactivating the idleinternal function module.

As represented by block 22-6, the method includes determining whether ornot the IFI is idle. If the IFI is not idle (No path from 22-6), in oneembodiment it is assumed that entering a sleep mode of operation wouldbe disruptive to ongoing computing by the chip. As such, as indicated byblock 22-13, the method terminates. On the other hand, if the IFI isidle (Yes path from 22-6), as represented by block 22-7, the methodincludes determining if an IFI sleep timer has expired, indicating thatthe IFI has been idle for at least as long as the initial value of thetimer. If the timer has not expired (No path from 22-7), as representedby block 22-13, the method terminates. If the timer has expired (Yespath from 22-7), as represented by block 22-8, the method includesdeactivating the idle IFI.

As represented by block 22-9, the method includes determining whether ornot the CCP is idle. If the CCP is not idle (No path from 22-9), in oneembodiment it is assumed that entering a sleep mode of operation wouldbe disruptive to ongoing computing by the chip. As such, as indicated byblock 22-13, the method terminates. On the other hand, if the CCP isidle (Yes path from 22-9), as represented by block 22-10, the methodincludes determining if a CCP sleep timer has expired, indicating thatthe CCP has been idle for at least as long as the initial value of thetimer. If the timer has not expired (No path from 22-10), as representedby block 22-13, the method terminates. If the timer has expired (Yespath from 22-10), as represented by block 22-11, the method includesdeactivating the idle CCP. And as represented by block 22-13, the methodterminates.

FIG. 23 is a flowchart illustrating one embodiment of a method ofreactivating an integrated circuit in a sleep mode of operation in adistributing computing system. The illustrated method can be modified ina variety of ways. For example, in another embodiment, various portionsof the illustrated method can be combined, can be rearranged in analternate sequence, removed, or the like. Specifically, FIG. 23illustrates a method of enabling a chip to sense conditions indicativeof higher activity and automatically and autonomously exit a sleep modeof operation into an active state. In one embodiment, a chip isconfigured to sense and respond to a clock signal in accordance with oneof three configurations. In a first configuration, the ECI and CPS arereactivated and other elements remain in a sleep mode of operation. Inthis configuration, the ECI and CPS have the ability to passtransmission from a device to another device as in a normal operationbut without intervention by the CCP or the internal function module. Ina second configuration, substantially the on-chip elements arereactivated except for the IFI and the internal functional module. Inthis configuration transmission test and test of the dual interface maybe performed by a reactivation command of the IFI to test the operationand integrity of the IFI. In a third configuration, the entire chip isfully activated.

As represented by block 23-1, the method includes configuring anautomatic sleep mode reactivation sensing scheme. As represented byblock 23-2, the method includes determining whether available externallyprovided clocks were previously available. If it is determined that theexternal clocks were not previously available (No path from 23-2), asrepresented by block 23-9, the method includes automaticallyreactivating a number of modules included on a chip that were previouslyplaced into a sleep mode of operation. As represented by block 23-10,the method includes initializing the reactivated modules on the chip. Inone embodiment, initializing the reactivated modules on the chipincludes setting the all the modules on the chip with predeterminedvalues and/or biasing the modules to particular operating points. Asrepresented by block 23-11, the method includes enabling the ECI outputclocks.

Referring again to block 23-2, if the external clocks were available(Yes path from 23-2), as represented by block 23-3 through 22-8, themethod includes determining which modules are in sleep mode andreactivating those modules. For example, as represented by block 23-3,the method includes determining whether or not the CCP is in sleep mode.If the CCP is in sleep mode (Yes path from 23-3), as represented byblock 23-4, the method includes reactivating the CCP. As represented byblock 23-5, the method includes determining whether or not the IFI is insleep mode. If the IFI is in sleep mode (Yes path from 23-5), asrepresented by block 23-6, the method includes reactivating the IFI. Asrepresented by block 23-7, the method includes determining whether ornot the internal function module is in sleep mode. If the internalfunction module is in sleep mode (Yes path from 23-7), as represented byblock 23-8, the method includes reactivating the internal functionmodule. In one embodiment, the various components discussed above areactivated in the order presented herein. However, those skilled in theart will appreciate that the order presented is merely one example ofthe order in which various components on a chip can be reactivated froma sleep mode of operation.

The above description is provided to enable any person skilled in theart to make or use embodiments within the scope of the appended claims.Various modifications to these aspects will be readily apparent to thoseskilled in the art, and the generic principles defined herein may beapplied to other aspects without departing from the scope of thedisclosure. Thus, the present disclosure is not intended to be limitedto the aspects shown herein but is to be accorded the widest scopeconsistent with the principles and novel features disclosed herein.

For example, a skilled artisan will recognize from the presentdisclosure that various methods of manufacture, design, and materialscan be used to make the various components described herein.Additionally, other combinations, omissions, substitutions andmodifications will be apparent to the skilled artisan in view of thedisclosure herein. It is contemplated that various aspects and featuresof the invention described can be practiced separately, combinedtogether, or substituted for one another, and that a variety ofcombination and sub-combinations of the features and aspects can be madeand still fall within the scope of the invention. Furthermore, thesystems described above need not include all of the modules andfunctions described in the preferred embodiments. Accordingly, thepresent invention is not intended to be limited by the recitation of thepreferred embodiments, but is to be defined by reference to the appendedclaims.

It should be understood that any reference to an element herein using adesignation such as “first,” “second,” and so forth does not generallylimit the quantity or order of those elements. Rather, thesedesignations may be used herein as a convenient method of distinguishingbetween two or more elements or instances of an element. Thus, areference to first and second elements does not mean that only twoelements may be employed there or that the first element must precedethe second element in some manner. Also, unless stated otherwise a setof elements may comprise one or more elements.

Those of skill in the art would understand that information and signalsmay be represented using any of a variety of different technologies andtechniques. For example, data, instructions, commands, information,signals, bits, symbols, and chips that may be referenced throughout theabove description may be represented by voltages, currents,electromagnetic waves, magnetic fields or particles, optical fields orparticles, or any combination thereof.

Those of skill would further appreciate that any of the variousillustrative logical blocks, modules, processors, means, circuits, andalgorithm steps described in connection with the aspects disclosedherein may be implemented as electronic hardware (e.g., a digitalimplementation, an analog implementation, or a combination of the two,which may be designed using source coding or some other technique),various forms of program or design code incorporating instructions(which may be referred to herein, for convenience, as “software” or a“software module), or combinations of both. To clearly illustrate thisinterchangeability of hardware and software, various illustrativecomponents, blocks, modules, circuits, and steps have been describedabove generally in terms of their functionality. Whether suchfunctionality is implemented as hardware or software depends upon theparticular application and design constraints imposed on the overallsystem. Skilled artisans may implement the described functionality invarying ways for each particular application, but such implementationdecisions should not be interpreted as causing a departure from thescope of the present disclosure.

It is understood that any specific order or hierarchy of steps in anydisclosed process is an example of a sample approach. Based upon designpreferences, it is understood that the specific order or hierarchy ofsteps in the processes may be rearranged while remaining within thescope of the present disclosure. The accompanying method claims presentelements of the various steps in a sample order, and are not meant to belimited to the specific order or hierarchy presented.

1. An integrated circuit package comprising: a first conductive trayhaving a planar inner surface and a sidewall extending from the planarinner surface, the planar inner surface configured to receive andprovide an electrical ground connection to a first integrated circuitdie; and a second conductive tray having a planar inner surface and asidewall extending from the planar inner surface, the planar innersurface configured to receive and provide an electrical groundconnection to a second integrated circuit die such that after assembly,the first die and second die are disposed facing one another, andwherein the respective sidewalls of the first a second conductive traysmate so as to make contact and also provide at least one gap throughwhich a signal lead can extend; at least one electrical ground tabconnectable to at least one of the first conductive tray or the secondconductive tray and also connectable to at least one of the first die orthe second die; at least one signal tab extending through a respectivegap between the respective sidewalls of the first and second conductivetrays; and at least one power line enveloped by an insulator abuttingthe first and second conductive trays, the at least one power lineincluding at least one contact connectable to at least one of the firstdie and the second die.
 2. The integrated circuit package of claim 1,wherein at least one of the first conductive tray and second conductivetray further comprises a respective planar outer surface substantiallyparallel to the respective planner inner surface.
 3. The integratedcircuit package of claim 1, wherein the at least one ground lead iscoupled to the sidewall of the first conductive tray.
 4. The integratedcircuit package of claim 1, wherein at least the portion of the signaltab extending through the respective gap is surrounded by an insulatingmaterial.
 5. The integrated circuit package of claim 1, wherein theplanar surfaces of the first and second conductive trays aresubstantially hexagonal.
 6. The integrated circuit package of claim 5,wherein at least one of the corners of the package is configured toprovide space for a power line surrounded by an insulator.
 7. Theintegrated circuit package of claim 5, wherein each of the corners ofthe package are configured to provide space for a power line surroundedby an insulator.
 8. The integrated circuit package of claim 5, whereineach side of the hexagonal package includes one or more connections torespective ground tabs extending into the interior of the package. 9.The integrated circuit package of claim 5, wherein each side of thehexagonal package includes one or more gaps through which respectivesignal tabs extend into the interior of the package and out of thepackage.
 10. The integrated circuit package of claim 9, wherein each gapincludes an insulator surrounding a respective signal tab.
 11. Anapparatus comprising: a first substrate for supporting a plurality ofdual-chip carriers, the first substrate having first and second sides; aplurality of dual-chip carriers disposed on the first side of the firstsubstrate, each dual-chip carrier comprising: a first conductive trayhaving a planar inner surface and a sidewall extending from the planarinner surface, the planar inner surface configured to receive andprovide an electrical ground connection to a first integrated circuitdie; and a second conductive tray having a planar inner surface and asidewall extending from the planar inner surface, the planar innersurface configured to receive and provide an electrical groundconnection to a second integrated circuit die, wherein once assembledthe first die and second die are disposed facing one another, andwherein the respective sidewalls of the first a second conductive traysmate so as to make contact and also provide at least one gap throughwhich a signal lead can extend; at least one electrical ground tabconnectable to at least one of the first and second conductive trays andalso connectable to at least one of the first die or the second die; atleast one signal tab extending through a respective gap between therespective sidewalls of the first and second conductive trays; and atleast one power line enveloped by an insulator abutting the first andsecond conductive trays, the at least one power line including at leastone contact connectable to at least one of the first die or the seconddie.
 12. The apparatus of claim 11, further comprising a first heatdissipation element abutting the first substrate.
 13. The apparatus ofclaim 12, wherein the first heat dissipation element includes at leastone of a corrugated spacing material, a honeycomb shaped spacingmaterial and patterned spacing material substantially allowing the freeflow of air across at least a portion of the second side of the firstsubstrate.
 14. The apparatus of claim 12, further comprising a secondheat dissipation element abutting the first heat dissipation element.15. The apparatus of claim 14, wherein the second heat dissipationelement is a blade extending wider than the substrate.
 16. The apparatusof claim 14, further comprising: a third heat dissipation element,wherein the second heat dissipation element is disposed between thefirst and third heat dissipation elements; and a second substrate forsupporting a plurality of dual-chip carriers, the second substratehaving first and second sides, wherein the third heat dissipationelement abuts the second side of the substrate.